HMC8142Data SheetABSOLUTE MAXIMUM RATINGSTHERMAL RESISTANCETable 2. ParameterRatingTable 3. Thermal Resistance Drain Bias Voltage (V 1 DD1 to VDD4) 4.5 V Package TypeθJCUnit Gate Bias Voltage (VGG1 to VGG4) −3 V to 0 V 25-Pad Bare Die [CHIP] 48.33 °C/W Maximum Junction Temperature (to 175°C 1 Based on ABLETHERM® 2600BT as die attach epoxy with thermal Maintain 1 Million Hours Mean Time to conductivity of 20 W/mK. Failure (MTTF)) Storage Temperature Range −65°C to +150°C ESD CAUTION Operating Temperature Range −55°C to +85°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 4 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GAAS MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE
