Datasheet BLF881 (Ampleon) - 9

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BLF881; BLF881S UHF power LDMOS transistor 8. Test information Table 8. List of components
For test circuit, see Figure 10, Figure 11 and Figure 12.
Component Description Value Remarks
C1, C2 multilayer ceramic chip capacitor 5.1 pF [1] C3, C4 multilayer ceramic chip capacitor 10 pF [2] C5 multilayer ceramic chip capacitor 6.8 pF [1] C6 multilayer ceramic chip capacitor 4.7 pF [1] C7 multilayer ceramic chip capacitor 2.7 pF [1] C8, C9, C10, C25, multilayer ceramic chip capacitor 100 pF [1] C26 C11, C27 multilayer ceramic chip capacitor 10 F TDK C570X7R1H106KT000N or capacitor of same quality. C12 electrolytic capacitor 470 F; 63 V C20 multilayer ceramic chip capacitor 10 pF [3] C21 multilayer ceramic chip capacitor 8.2 pF [3] C22 trimmer 0.6 pF to 4.5 pF Tekelec C23 multilayer ceramic chip capacitor 6.8 pF [3] C24 multilayer ceramic chip capacitor 3.9 pF [3] L1 stripline - [4] (W  L) 7 mm  15 mm L2 stripline - [4] (W  L) 2.4 mm  9 mm L3 stripline - [4] (W  L) 2.4 mm  10 mm L4 stripline - [4] (W  L) 2.4 mm  25 mm L5 stripline - [4] (W  L) 2.4 mm  10 mm L6 stripline - [4] (W  L) 2.0 mm  20 mm L7 stripline - [4] (W  L) 2.0 mm  21 mm L20 stripline - [4] (W  L) 7 mm  12 mm L21 stripline - [4] (W  L) 2.4 mm  13 mm L22 stripline - [4] (W  L) 2.4 mm  31 mm L23 stripline - [4] (W  L) 2.4 mm  5 mm R1 resistor 100 R2 resistor 10 k [1] American technical ceramics type 100B or capacitor of same quality. [2] American technical ceramics type 180R or capacitor of same quality. [3] American technical ceramics type 100A or capacitor of same quality. [4] Printed-Circuit Board (PCB): Rogers 5880; r = 2.2 F/m; height = 0.79 mm; Cu (top/bottom metallization); thickness copper plating = 35 m. BLF881_BLF881S#4 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 4 — 1 September 2015 9 of 18
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 2. Pinning information 3. Ordering information 4. Limiting values 5. Thermal characteristics 6. Characteristics 7. Application information 7.1 Narrowband RF figures 7.1.1 CW 7.1.2 2-Tone 7.1.3 DVB-T 7.2 Broadband RF figures 7.2.1 DVB-T 7.3 Ruggedness in class-AB operation 7.4 Reliability 8. Test information 9. Package outline 10. Abbreviations 11. Revision history 12. Legal information 12.1 Data sheet status 12.2 Definitions 12.3 Disclaimers 12.4 Licenses 12.5 Trademarks 13. Contact information 14. Contents