Datasheet REF34-Q1 (Texas Instruments) - 8

REF34-Q1
SBAS901C – JULY 2018 – REVISED OCTOBER 2020
www.ti.com 8 Typical Characteristics (continued)
at TA = 25°C, VIN = VEN = 12 V, IL = 0 mA, CL = 10 µF, CIN = 0.1 µF (unless otherwise noted) 8.7 55 ) 8.4 ) 52.5 mA 8.1 mA 50 (ppm/ 7.8 (ppm/ 47.5 ing ing rc 7.5 k 45 Sou 7.2 Sin 42.5 ion ion 6.9 40 6.6 egulat 37.5 egulat R R 6.3 35 Load Load 6 32.5 5.7 30 -40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) Temperature (°C) D020 D021
Figure 8-7. Load Regulation Sourcing Figure 8-8. Load Regulation Sinking
800 ILOAD 720 +1mA +1mA 640 560 z) H 480 -1mA 1mA/div (nV/v 400 VOUT se 4mV/div oi 320 N 240 160 80 0 250µs/div 10 100 1k 10k 100k Frequency(Hz) (CL = 1µF, IOUT = 1mA) D010 D009
Figure 8-9. Noise Performance 10 Hz to 10 kHz Figure 8-10. Load Transient
I I LOAD LOAD +1mA +1mA +10mA +10mA 10mA/div -1mA -10mA 1mA/div V VOUT OUT 100mV/div 4mV/div 250µs/div 250µs/div (CL = 1µF, IOUT = 10mA) D010 (CL = 10µF, IOUT = 1mA) D010
Figure 8-12. Load Transient Figure 8-11. Load Transient
8 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: REF34-Q1 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Table 6 Pin Configuration and Functions 6.1 Pin Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 ESD Ratings 7.3 Recommended Operating Conditions 7.4 Thermal Information 7.5 Electrical Characteristics 8 Typical Characteristics 9 Parameter Measurement Information 9.1 Solder Heat Shift 9.2 Long-Term Stability 9.3 Thermal Hysteresis 9.4 Power Dissipation 9.5 Noise Performance 10 Detailed Description 10.1 Overview 10.2 Functional Block Diagram 10.3 Feature Description 10.3.1 Supply Voltage 10.3.2 Low Temperature Drift 10.3.3 Load Current 10.4 Device Functional Modes 10.4.1 EN Pin 11 Application and Implementation 11.1 Application Information 11.2 Typical Applications 11.2.1 Basic Voltage Reference Connection 11.2.1.1 Design Requirements 11.2.1.2 Detailed Design Procedure 11.2.1.2.1 Input and Output Capacitors 11.2.1.2.2 4-Wire Kelvin Connections 11.2.1.2.3 V​IN Slew Rate Considerations 11.2.1.2.4 Shutdown/Enable Feature 11.2.1.3 Application Curves 11.2.2 Advanced Driver Assistance Systems (ADAS) Microcontroller Connection 11.2.2.1 Basic Voltage Reference Connection 11.2.2.2 Design Requirements 11.2.2.3 Detailed Design Procedure 11.2.2.4 Enable Feature in ADAS 12 Power Supply Recommendations 13 Layout 13.1 Layout Guidelines 13.2 Layout Example 14 Device and Documentation Support 14.1 Documentation Support 14.1.1 Related Documentation 14.2 Receiving Notification of Documentation Updates 14.3 Support Resources 14.4 Trademarks 14.5 Electrostatic Discharge Caution 14.6 Glossary 15 Mechanical, Packaging, and Orderable Information