link to page 5 STGAP3S6I, STGAP3S6S, STGAP3SXI, STGAP3SXSDevice ratings3.3Recommended operating conditionsTable 4. Recommended operating conditionsSymbolParameterMin.Max.Unit VDD Logic supply voltage vs. GND 3.1 5.5 V VLOGIC Logic pins (IN+, IN-, RST) voltage vs. GND 0 5.5 V VH Positive supply voltage (VH vs. GNDISO) 5 32 V VL Negative supply voltage (VL vs. GNDISO) -10 0 V VHL Differential supply voltage (VH vs. VL) - 32 V VDESATth Threshold voltage of DESAT protection vs. GND - VH - 2 V FSW Maximum switching frequency (1) - 1 MHz TJ Operating junction temperature -40 125 °C Tamb Ambient temperature -40 125 °C 1. Actual limit depends on power dissipation and TJ. DS14758 - Rev 1page 5/32 Document Outline STGAP3S6I, STGAP3S6S, STGAP3SXI, STGAP3SXS @NA Cover image @NA Device summary Features Applications Description 1 Block diagram 2 Pin description and connection diagram 3 Device ratings 3.1 Absolute maximum ratings 3.2 Thermal data 3.3 Recommended operating conditions 4 Electrical characteristics 5 Isolation 6 Functional description 6.1 Power supplies and UVLO 6.2 Power-up, power-down, and “safe state” 6.3 Control inputs 6.3.1 Anti cross conduction interlocking 6.4 Miller clamp function 6.4.1 Miller clamp driver 6.5 Desaturation protection 6.5.1 Adjustable soft turn-off function 6.6 Watchdog 6.7 Thermal shutdown protection 7 Typical application diagram 8 PCB layout 8.1 Layout guidelines and considerations 8.2 Layout example 9 Unused functions 10 Testing and characterization information 11 Package information 11.1 SO-16W package information 11.2 SO-16W suggested land pattern 12 Ordering information Revision history Contents List of tables List of figures
