ADG608/ADG609ABSOLUTE MAXIMUM RATINGS1 SOIC Package (T θ A = +25°C unless otherwise noted) JA, Thermal Impedance . 77°C/W VDD to VSS . +13 V Lead Temperature, Soldering V Vapor Phase (60 sec) . +215°C DD to GND . –0.3 V to +6.5 V V Infrared (15 sec) . +220°C SS to GND . +0.3 V to –6.5 V Analog, Digital Inputs2 . –0.3 V to VDD + 2 V TSSOP Package or 20 mA, Whichever Occurs First θJA, Thermal Impedance . 158°C/W Continuous Current, S or D . 20 mA Lead Temperature, Soldering Peak Current, S or D Vapor Phase (60 sec) . +215°C (Pulsed at 1 ms, 10% Duty Cycle Max) . 40 mA Infrared (15 sec) . +220°C Operating Temperature Range ESD Rating . >5000 V Industrial (B Version) . –40°C to +85°C NOTES 1 Extended (T Version) . – 55°C to +125°C Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional Storage Temperature Range . –65°C to +150°C operation of the device at these or any other conditions above those listed in the Junction Temperature . +150°C operational sections of this specification is not implied. Exposure to absolute Plastic DIP Package maximum rating conditions for extended periods may affect device reliability. θ Only one absolute maximum rating may be applied at any one time. JA, Thermal Impedance . 117°C/W 2Overvoltages at A, S, D or EN will be clamped by internal diodes. Current should Lead Temperature, Soldering (10 sec) . +260°C be limited to the maximum ratings given. Table I. ADG608 Truth TableTable II. ADG609 Truth TableA2A1A0ENON SWITCHA1A0ENON SWITCH PAIR X X X 0 NONE X X 0 NONE 0 0 0 1 1 0 0 1 1 0 0 1 1 2 0 1 1 2 0 1 0 1 3 1 0 1 3 0 1 1 1 4 1 1 1 4 1 0 0 1 5 X = Don’t Care 1 0 1 1 6 1 1 0 1 7 1 1 1 1 8 X = Don’t Care PIN CONFIGURATIONSDIP/SOIC/TSSOPDIP/SOIC/TSSOPA0116 A1A0116 A1EN215 GNDEN215 A2V314 VSSDDVGNDSS314S1A4ADG60913 S1BS14ADG60813 VDDTOP VIEWTOP VIEWS2A512 S2B(Not to Scale)S2512(Not to Scale)S5S3A611 S3BS3611 S6S4A710 S4BS4710 S7DA89 DBD89 S8 REV. A –5–