Клеммные колодки Keen Side

Datasheet C2M0080170P (Wolfspeed) - 2

ПроизводительWolfspeed
ОписаниеSilicon Carbide Power MOSFET 1700 V 40 A 80 mΩ
Страниц / Страница10 / 2 — Electrical Characteristics. Symbol. Parameter. Min. Typ. Max. Unit. Test …
Формат / Размер файлаPDF / 1.2 Мб
Язык документаанглийский

Electrical Characteristics. Symbol. Parameter. Min. Typ. Max. Unit. Test Conditions. Note. Reverse Diode Characteristics

Electrical Characteristics Symbol Parameter Min Typ Max Unit Test Conditions Note Reverse Diode Characteristics

AiPCBA
Весь мир
C2M0080170P
Cree
3 445 ₽
ChipWorker
Весь мир
C2M0080170P
Wolfspeed
3 452 ₽
T-electron
Россия и страны СНГ
C2M0080170P
300 557 ₽
LED-драйверы MOSO для индустриальных приложений

Модельный ряд для этого даташита

Текстовая версия документа

Electrical Characteristics
(T = 25˚C unless otherwise specified) C
Symbol Parameter Min. Typ. Max. Unit Test Conditions Note
V(BR)DSS Drain-Source Breakdown Voltage 1700 V VGS = 0 V, ID = 100 μA 2.0 2.6 4 V VDS = VGS, ID = 10 mA VGS(th) Gate Threshold Voltage Fig. 11 2.0 V VDS = VGS, ID = 10 mA, TJ = 150ºC IDSS Zero Gate Voltage Drain Current 1 100 μA VDS = 1700 V, VGS = 0 V IGSS Gate-Source Leakage Current 250 nA VGS = 20 V, VDS = 0 V 80 125 VGS = 20 V, ID = 28 A R Fig. 4, DS(on) Drain-Source On-State Resistance mΩ 5, 6 150 VGS = 20 V, ID = 28 A, TJ = 150ºC 9.73 VDS= 20 V, IDS= 20 A gfs Transconductance S Fig. 7 10.07 VDS= 20 V, IDS= 20 A, TJ = 150ºC Ciss Input Capacitance 2250 VGS = 0 V Coss Output Capacitance 105 pF Fig. 17, VDS = 1000 V 18 Crss Reverse Transfer Capacitance 4 f = 1 MHz VAC = 25 mV Eoss Coss Stored Energy 65 μJ Fig. 16 E V = 20A, ON Turn-On Switching Energy (SiC Diode FWD) 0.3 DS = 1200 V, VGS = -5/20 V, ID mJ Fig. 26, R = 2.5Ω, L= 200 μH, T G(ext) J = 150ºC, 29b EOFF Turn Off Switching Energy (SiC Diode FWD) 0.1 Using SiC Diode as FWD E V = 20A, ON Turn-On Switching Energy (Body Diode FWD) 1.1 DS = 1200 V, VGS = -5/20 V, ID mJ Fig. 26, R = 2.5Ω, L= 200 μH, T G(ext) J = 150ºC, 29a EOFF Turn Off Switching Energy (Body Diode FWD) 0.1 Using MOSFET as FWD td(on) Turn-On Delay Time 25 VDD = 1200 V, VGS = -5/20 V tr Rise Time 9 I ns D = 20 A, RG(ext) = 2.5 Ω, Timing relative to V Fig. 27 DS td(off) Turn-Off Delay Time 34 Inductive load tf Fall Time 18 RG(int) Internal Gate Resistance 2 Ω f = 1 MHz, VAC = 25 mV Qgs Gate to Source Charge 28 VDS = 1200 V, VGS = -5/20 V Qgd Gate to Drain Charge 33 nC ID = 20 A Fig. 12 Per IEC60747-8-4 pg 21 Qg Total Gate Charge 120
Reverse Diode Characteristics Symbol Parameter Typ. Max. Unit Test Conditions Note
4.1 V V = - 5 V, I = 10 A V GS SD Fig. 8, SD Diode Forward Voltage 9, 10 3.6 V V = - 5 V, I = 10 A, T = 150 °C GS SD J I = - 5 V S Continuous Diode Forward Current 28 A TC = 25˚C, VGS Note 1 t Reverse Recover time 36 ns rr V = - 5 V, I = 20 A, V = 1200 V GS SD R Q Reverse Recovery Charge 1 µC rr dif/dt = 2600 A/µs, T = 150 °C Note 1 J I Peak Reverse Recovery Current 38 A rrm
Thermal Characteristics Symbol Parameter Typ. Max. Unit Test Conditions Note
RθJC Thermal Resistance from Junction to Case 0.37 0.45 °C/W Fig. 21 RθJA Thermal Resistance From Junction to Ambient 40
2
C2M0080170P Rev. A, 05-2018
Электронные компоненты. Скидки, кэшбэк и бесплатная доставка от ТМ Электроникс