HMC564 v02.0618 GaAs PHEMT MMIC LOW NOISEAMPLIFIER, 7 - 13.5 GHzMounting & Bonding Techniques for Millimeterwave GaAs MMICs The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting, Bonding Note). 0.102mm (0.004”) Thick GaAs MMIC IP 50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film H Wire Bond substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.076mm C 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be (0.003”) raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface - of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick S die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then R attached to the ground plane (Figure 2). RF Ground Plane IE Microstrip substrates should be brought as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm (3 mils). LIF Handling Precautions 0.127mm (0.005”) Thick Alumina P Follow these precautions to avoid permanent damage. Thin Film Substrate M Figure 1. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the A sealed ESD protective bag has been opened, all die should be stored in a dry 0.102mm (0.004”) Thick GaAs MMIC E nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean IS the chip using liquid cleaning systems. Wire Bond 0.076mm O Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD (0.003”) strikes. N Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. W General Handling: Handle the chip along the edges with a vacuum collet or with RF Ground Plane a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and LO should not be touched with vacuum collet, tweezers, or fingers. 0.150mm (0.005”) Thick Mounting Moly Tab 0.254mm (0.010”) Thick Alumina The chip is back-metallized and can be die mounted with AuSn eutectic preforms or Thin Film Substrate with electrically conductive epoxy. The mounting surface should be clean and flat. Figure 2. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31 mm (12 mils). For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com 7 Application Support: Phone: 1-800-ANALOG-D
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