Datasheet ADP1720-EP (Analog Devices) - 5

Data Sheet ADP1720-EP ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
θ IN to GND –0.3 V to +30 V JA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. OUT to GND –0.3 V to IN or +6 V (whichever is less)
Table 3. Thermal Resistance
EN to GND –0.3 V to +30 V
Package Type θ θ Unit JA JC
ADJ to GND –0.3 V to +6 V 8-Lead MSOP 246 66 °C/W Storage Temperature Range –65°C to +150°C Operating Junction –55°C to +125°C Temperature Range
ESD CAUTION
Soldering Conditions JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 5 of 12 Document Outline Features Enhanced Product Features Applications Typical Application Circuits General Description Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Applications Information Thermal Considerations Outline Dimensions Ordering Guide