ADP7159Data SheetPIN CONFIGURATIONS AND FUNCTION DESCRIPTIONSVOUT 110 VINVOUT 18VINVOUT 29 VINVOUT_SENSE 2ADP71597VREGADP7159TOP VIEWVOUT_SENSE 38 VREGBYP 3(Not to Scale)6REFTOP VIEW(Not to Scale)EN 45REF_SENSEBYP 47 REFEN 56 REF_SENSENOTES 1. THE EXPOSED PAD IS LOCATED ON THE BOTTOM OFNOTES 1. THE EXPOSED PAD IS LOCATED ON THE BOTTOM OFTHE PACKAGE. THE EXPOSED PAD ENHANCES THERMALTHE PACKAGE. THE EXPOSED PAD ENHANCESPERFORMACE, AND IT IS ELECTRICALLY CONNECTED TOTHERMAL PERFORMANCE, AND IT IS ELECTRICALLYGROUND INSIDE THE PACKAGE. CONNECT THE EXPOSEDCONNECTED TO GROUND INSIDE THE PACKAGE. 004 003 PAD TO THE GROUND PLANE ON THE BOARD TO ENSURECONNECT THE EXPOSED PAD TO THE GROUND PLANEPROPER OPERATION.ON THE BOARD TO ENSURE PROPER OPERATION. 12939- 12939- Figure 3. 10-Lead LFCSP Pin Configuration Figure 4. 8-Lead SOIC Pin Configuration Table 6. Pin Function DescriptionsPin No.LFCSP SOICMnemonicDescription 1, 2 1 VOUT Regulated Output Voltage. Bypass VOUT to ground with a 10 µF or greater capacitor. 3 2 VOUT_SENSE Output Sense. VOUT_SENSE is internal y connected to VOUT with a 10 Ω resistor. Connect VOUT_SENSE as close to the load as possible. 4 3 BYP Low Noise Bypass Capacitor. Connect a 1 µF or greater capacitor from the BYP pin to ground to reduce noise. Do not connect a load to this pin. 5 4 EN Enable. Drive EN high to turn on the regulator, and drive EN low to turn off the regulator. For automatic startup, connect EN to VIN. 6 5 REF_SENSE Reference Sense. This pin sets the output voltage with an external resistor divider. VOUT = VREF × (R1 + R2)/R2, where VREF = 1.2 V. Connect REF_SENSE to the REF pin. Do not connect REF_SENSE to VOUT or ground. 7 6 REF Low Noise Reference Voltage Output. Bypass REF to ground with a 1 µF or greater capacitor. Short REF_SENSE to REF for fixed output voltages. Do not connect a load to this pin. 8 7 VREG Regulated Input Supply Voltage to the LDO Amplifier. Bypass VREG to ground with a 1 µF or greater capacitor. 9, 10 8 VIN Regulator Input Supply Voltage. Bypass VIN to ground with a 10 µF or greater capacitor. EP Exposed Pad. The exposed pad is located on the bottom of the package. The exposed pad enhances thermal performance, and it is electrically connected to ground inside the package. Connect the exposed pad to the ground plane on the board to ensure proper operation. Rev. B | Page 6 of 23 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATION CIRCUIT REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL DATA THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION ADIsimPOWER DESIGN TOOL CAPACITOR SELECTION Output Capacitor Input and VREG Capacitor REF Capacitor BYP Capacitor Capacitor Properties UNDERVOLTAGE LOCKOUT (UVLO) PROGRAMMABLE PRECISION ENABLE START-UP TIME REF, BYP, AND VREG PINS CURRENT-LIMIT AND THERMAL SHUTDOWN THERMAL CONSIDERATIONS Thermal Characterization Parameter (ΨJB) PSRR PERFORMANCE PCB LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE