link to page 4 link to page 4 RN52FIGURE 1-1:MODULE DIMENSIONS(Top View)(Side View) 0.75 12.75 26.00 26.00 Dimensions are in millimeters Tolerances: 21.40 PCB Outline: +/- 0.13 mm 21.20 21.40 PCB Thickness: +/- 0.100 mm 20.00 18.80 17.60 16.40 15.20 14.00 12.80 11.60 10.40 9.20 8.00 6.80 5.60 4.40 3.20 2.00 0.70 0.0 0.00 0.00 0.85 2.55 3.75 4.95 6.15 7.35 8.55 9.75 2.70 0.80 0.00 10.95 12.65 13.50 FIGURE 1-2:RECOMMENDED PCB FOOTPRINT(Top View) 3.25 4.65 6.05 7.45 8.85 10.25 0.8mm 1.6mm 26.00 21.20 21.40 Host Ground Plane Edge 20.00 20.70 (See Mounting Details) 18.80 17.60 16.40 15.20 Ground Pads 14.00 0.8 x 1.0 mm 12.80 11.60 10.40 0.80mm 9.20 8.00 6.80 5.60 4.40 3.20 2.00 0.0 0.00 0.85 2.55 3.75 4.95 6.15 7.35 8.55 9.75 10.95 12.65 13.50 Dimensions are in millimeters Figure 1-3 shows the pinout and Table 1-4 describes the module’s pins. 2015 Microchip Technology Inc. DS70005120A-page 3 Document Outline RN52 Features: Applications: RN52 Block Diagram: 1.0 Device Overview TABLE 1-1: General Specifications TABLE 1-2: Weight and Dimensions TABLE 1-3: Electrical Characteristics FIGURE 1-1: Module Dimensions FIGURE 1-2: Recommended PCB Footprint FIGURE 1-3: Pin Diagram TABLE 1-4: Pin Description(1) (Sheet 1 of 3) 1.1 Audio Interface Circuit Description 1.1.1 Digital Audio Interface FIGURE 1-4: I2S and SPDIF Connections 1.1.2 Analog Audio Interface FIGURE 1-5: RN52 Audio Interface Block Diagram FIGURE 1-6: Stereo CODEC Audio Input/Output Stages 1.1.3 Analog-to-Digital Converter (ADC) FIGURE 1-7: ADC Analog Amplifier Block Diagram 1.1.4 Digital-to-Analog Converter (DAC) 1.1.4.1 Speaker Output 1.1.4.2 Microphone Input TABLE 1-5: Digital to Analog Converter TABLE 1-6: AnaLog to Digital Converter 1.2 General Purpose IO (GPIO) Ports TABLE 1-7: Digital Input and Output Voltage Levels 1.3 Power Consumption TABLE 1-8: Power Consumption 2.0 Applications 2.1 Minimizing Radio Interference FIGURE 2-1: Minimizing Radio Interference FIGURE 2-2: PCB Example Layout 2.2 LED Interface FIGURE 2-3: LED interface TABLE 2-1: Status LED Functions 2.3 Device Firmware Updates FIGURE 2-4: USB DFU Port and GPIO3 Schematic 2.4 Restore Factory Defaults with GPIO4 2.5 Power Control and Regulation 2.6 Solder Reflow Profile TABLE 2-2: Paste Solder Recommendations FIGURE 2-5: Solder Reflow Temperature Profile FIGURE 2-6: Solder Reflow Curve 2.7 Typical Application Schematic FIGURE 2-7: Typical Application Circuit for A2DP Audio Streaming and AVRCP Remote Control 3.0 Bluetooth SIG Certification 4.0 Regulatory Approval 4.1 United States 4.1.1 Labeling and User Information Requirements 4.1.2 RF Exposure 4.1.3 HELPFUL WEB SITES 4.2 Canada 4.2.1 Labeling and User Information Requirements 4.2.2 Helpful Web Sites 4.3 Europe 4.3.1 Labeling and User Information Requirements 4.3.2 Antenna Requirements 4.3.3 Helpful Web Sites TABLE 4-1: European Compliance Testing 4.4 Australia 4.4.1 Helpful Web Sites 4.5 New Zealand 4.5.1 Helpful Web Sites 5.0 Ordering Information TABLE 5-1: Ordering Information(1) 6.0 Revision History Revision A (September 2015) Notes: RN52 Bluetooth® Audio Module AMERICAS Corporate Office Atlanta Austin, TX Boston Chicago Cleveland Dallas Detroit Houston, TX Indianapolis Los Angeles New York, NY San Jose, CA Canada - Toronto ASIA/PACIFIC Asia Pacific Office Hong Kong Australia - Sydney China - Beijing China - Chengdu China - Chongqing China - Dongguan China - Hangzhou China - Hong Kong SAR China - Nanjing China - Qingdao China - Shanghai China - Shenyang China - Shenzhen China - Wuhan China - Xian ASIA/PACIFIC China - Xiamen China - Zhuhai India - Bangalore India - New Delhi India - Pune Japan - Osaka Japan - Tokyo Korea - Daegu Korea - Seoul Malaysia - Kuala Lumpur Malaysia - Penang Philippines - Manila Singapore Taiwan - Hsin Chu Taiwan - Kaohsiung Taiwan - Taipei Thailand - Bangkok EUROPE Austria - Wels Denmark - Copenhagen France - Paris Germany - Dusseldorf Germany - Karlsruhe Germany - Munich Italy - Milan Italy - Venice Netherlands - Drunen Poland - Warsaw Spain - Madrid Sweden - Stockholm UK - Wokingham Worldwide Sales and Service
