LTM8029 ABSOLUTE MAXIMUM RATINGSPIN CONFIGURATION(Notes 1, 2) V TOP VIEW IN, RUN ..40V VOUT, BIAS ..20V V 5 IN V BANK 1 VOUT IN + BIAS ...55V 4 PGOOD , FB, RT ..6V BANK 3 3 BIAS Internal Operating Temperature Range (Note 2) FB PGOOD GND 2 E and I Grades ... –40ºC to 125°C RUN RT BANK 2 MP Grade ..–55ºC to 125ºC 1 Storage Temperature Range ...–65ºC to 150ºC A B C D E F G H Peak Solder Reflow Package Body Temperature ...260°C BGA PACKAGE 35-LEAD (11.25mm × 6.25mm × 3.42mm) TJMAX = 125°C, θJA = 13.8°C/W, θJCtop = 17.2°C/W, θJCbottom = 3.9°C/W, θJB = 9.0°C/W WEIGHT = 0.6g ORDER INFORMATIONPAD OR BALLPART MARKING*PART NUMBERFINISHDEVICECODEPACKAGE TYPEMSL RATINGTEMPERATURE RANGE (Note 2) LTM8029EY#PBF SAC305 (RoHS) LTM8029Y e1 BGA 3 –40°C to 125°C LTM8029IY#PBF SAC305 (RoHS) LTM8029Y e1 BGA 3 –40°C to 125°C LTM8029IY SnPb (63/37) LTM8029Y e0 BGA 3 –40°C to 125°C LTM8029MPY#PBF SAC305 (RoHS) LTM8029Y e1 BGA 3 –55°C to 125°C LTM8029MPY SnPb (63/37) LTM8029Y e0 BGA 3 –55°C to 125°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • LGA and BGA Package and Tray Drawings Rev. E 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Application Package Description Revision History Package Photo Design Resources Related Parts
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