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Datasheet HMC434-EP (Analog Devices) - 5

ПроизводительAnalog Devices
Описание0.2 GHz to 8 GHz, GaAs, HBT MMIC, Divide by 8 Prescaler
Страниц / Страница7 / 5 — Enhanced Product. HMC434-EP. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. …
ВерсияB
Формат / Размер файлаPDF / 208 Кб
Язык документаанглийский

Enhanced Product. HMC434-EP. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. NIC. OUT. GND. TOP VIEW. VCC. (Not to Scale)

Enhanced Product HMC434-EP PIN CONFIGURATION AND FUNCTION DESCRIPTIONS NIC OUT GND TOP VIEW VCC (Not to Scale)

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Enhanced Product HMC434-EP PIN CONFIGURATION AND FUNCTION DESCRIPTIONS NIC 1 6 OUT HMC434-EP GND 2 TOP VIEW 5 VCC (Not to Scale) IN 3 4 NIC NOTES 1. NOT INTERNALLY CONNECTED. THESE PINS CAN BE CONNECTED TO RF AND DC GROUND WITHOUT AFFECTING PERFORMANCE. THE NIC PINS ARE
002
TYPICALLY TIED TO GND FOR ENHANCED THERMAL PERFORMANCE (BUT NOT REQUIRED).
15647- Figure 2. Pin Configuration
Table 4. Pin Function Descriptions Pin No. Mnemonic Description
1, 4 NIC Not Internally Connected. These pins can be connected to RF and dc ground without affecting performance. The NIC pins are typically tied to GND for enhanced thermal performance (but not required). 2 GND Ground. This pin must be connected to both RF and dc ground. 3 IN RF Input. This pin must be dc blocked. 5 VCC Supply Voltage (3 V). 6 OUT RF Output. This pin must be dc blocked.
INTERFACE SCHEMATICS GND VCC
003
50Ω
15647-
OUT
005 15647- Figure 3. GND Interface Schematic Figure 5. OUT Interface Schematic
VCC VCC 50Ω 8pF
006 004
IN
15647- 15647- Figure 4. IN Interface Schematic Figure 6. VCC Interface Schematic Rev. B | Page 5 of 7 Document Outline Features Enhanced Product Features Applications Functional Block Diagram General Description Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Outline Dimensions Ordering Guide
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