Datasheet KSZ9893RNX (Microchip) - 5

KSZ9893RNX FIGURE 2-2: PACKAGE (DIMENSIONS) 64-Lead Very Thin Plastic Quad Flat, No Lead Package (JXX) - 8x8 mm Body [VQFN] Note:
For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging (A3) A C SEATING PLANE A1 DETAIL A Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Terminals N 64 Pitch e 0.40 BSC Overall Height A 0.80 0.85 0.90 Standoff A1 0.00 0.02 0.05 Terminal Thickness A3 0.20 REF Overall Length D 8.00 BSC Exposed Pad Length D2 6.40 6.50 6.60 Overall Width E 8.00 BSC Exposed Pad Width E2 6.40 6.50 6.60 Terminal Width b 0.15 0.20 0.25 Terminal Length L 0.35 0.40 0.45 Terminal-to-Exposed-Pad K 0.25 - - Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-437A Sheet 2 of 2 DS00002318A-page 5  2016 Microchip Technology Inc. Document Outline Highlights Target Applications Features 1.0 Introduction 1.1 General Description FIGURE 1-1: Internal Block Diagram 2.0 Package Information 2.1 Package Drawings FIGURE 2-1: Package (Drawing) FIGURE 2-2: Package (Dimensions) FIGURE 2-3: Package (Land Pattern) Appendix A: PRODUCT BRIEF Revision History The Microchip Web Site Product Identification System Worldwide Sales and Service