ADM4073ABSOLUTE MAXIMUM RATINGS Table 2. Parameter RatingTHERMAL CHARACTERISTICS VCC to GND −0.3 V to +30 V θJA is specified for the worst-case conditions, that is, a device RS+, RS− to GND −0.3 V to +30 V soldered in a circuit board for surface-mount packages. OUT to GND −0.3 V to (VCC + 0.3 V) OUT Short-Circuit to GND Continuous Table 3. Thermal Resistance Differential Input Voltage (V Package Typeθ RS+ − VRS−) ±5 V JA Unit Current into Any Pin ±20 mA 6-Lead SOT-23 169.5 °C/W Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +125°C ESD CAUTION Lead Temperature, Soldering (10 sec) 300°C Junction Temperature 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 4 of 12 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM APPLICATION DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL CHARACTERISTICS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION RSENSE OUTPUT (OUT) OUTLINE DIMENSIONS ORDERING GUIDE
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