Datasheet TCR22-x (Littelfuse) - 7

Thyristors
1.5 Amp Sensitive SCRs
Soldering Parameters
Reflow Condition Pb – Free assembly
t T
P P - Temperature Min (T ) 150°C s(min)
e Ramp-up Ramp-u
Pre Heat - Temperature Max (T ) 200°C
T
L s(max)
t T
L - Time (min to max) (t ) 60 – 180 secs S(max) s
Ramp-dow Ramp-do n
Average ramp up rate (Liquidus Temp)
mperatur Preheat Preheat
5°C/second max
e
(T ) to peak
T
L
T
S(min) T to T - Ramp-up Rate 5°C/second max
t
S S(max) L - Temperature (T ) (Liquidus) 217°C Reflow L
25
- Temperature (t ) 60 – 150 seconds
time to peak temperature
L
Time
Peak Temperature (T ) 260+0/-5 °C P Time within 5°C of actual peak 20 – 40 seconds Temperature (t ) p Ramp-down Rate 5°C/second max Time 25°C to peak Temperature (T ) 8 minutes Max. P Do not exceed 280°C
Physical Specifications Environmental Specifications
Test Specifications and Conditions 100% Matt Tin-plated/Pb-free Solder
Terminal Finish
Dipped MIL-STD-750, M-1040, Cond A Applied
AC Blocking
Peak AC voltage @ 110°C for 1008 hours UL recognized epoxy meeting flammability
Body Material
MIL-STD-750, M-1051, rating 94V-0
Temperature Cycling
100 cycles; -40°C to +150°C; 15-min dwell-time
Lead Material
Copper Alloy EIA / JEDEC, JESD22-A101
Temperature/
1008 hours; 320V - DC: 85°C; 85%
Humidity
rel humidity MIL-STD-750, M-1031,
Design Considerations High Temp Storage
1008 hours; 150°C Careful selection of the correct component for the
Low-Temp Storage
1008 hours; -40°C application’s operating parameters and environment will
Resistance to
go a long way toward extending the operating life of the MIL-STD-750 Method 2031
Solder Heat
Thyristor. Good design practice should limit the maximum
Solderability
ANSI/J-STD-002, category 3, Test A continuous current through the main terminals to 75% of the component rating. Other ways to ensure long life for
Lead Bend
MIL-STD-750, M-2036 Cond E a power discrete semiconductor are proper heat sinking and selection of voltage ratings for worst case conditions. Overheating, overvoltage (including dv/dt), and surge currents are the main killers of semiconductors. Correct mounting, soldering, and forming of the leads also help protect against component damage. © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/16/18