Datasheet TCA0372, TCA0372B, NCV0372B (ON Semiconductor) - 9

TCA0372, TCA0372B, NCV0372B PACKAGE DIMENSIONS SOIC−16 WB
CASE 751G−03 ISSUE D
D A q
NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994.
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3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION. M 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. B 5. DIMENSION B DOES NOT INCLUDE DAMBAR _
H
PROTRUSION. ALLOWABLE DAMBAR M
E
PROTRUSION SHALL BE 0.13 TOTAL IN
8X X 45
EXCESS OF THE B DIMENSION AT MAXIMUM
h
MATERIAL CONDITION. 0.25
MILLIMETERS 1 8 DIM MIN MAX A
2.35 2.65
A1
0.10 0.25
16X B B B
0.35 0.49
C
0.23 0.32
D
10.15 10.45 0.25 M T A S B S
E
7.40 7.60
e
1.27 BSC
H
10.05 10.55
h
0.25 0.75
L
0.50 0.90
A q
0 7 _ _
L 14X e C SEATING A1 T PLANE SOLDERING FOOTPRINT*
16X 0.58 11.00 1 16X 1.62 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com 9