Datasheet HCPL-2201, HCPL-2202, HCPL-2211, HCPL-2212, HCPL-2231, HCPL-2232, HCPL-0201, HCPL-0211, HCNW2201, HCNW2211 (Avago Technologies) - 20

HCPL-2201, HCPL-2202, HCPL-2211, HCPL-2212, HCPL-2231, HCPL-2232, HCPL-0201, HCPL-0211, HCNW2201, HCNW2211
Data Sheet Very High CMR, Wide VCC Logic Gate Optocouplers
Figure 14: Recommended LSTTL to LSTTL Circuit for Applications Requiring a Maximum Allowable Propagation Delay of 300 ns HCPL-2201/11 HCPL-02XX HCNW22XX VCC2 (+5 V) 80
Ω
VCC1 (+5 V) 1 8 1.1 k
Ω
120 pF 2 7 DATA OUTPUT DATA INPUT 3 6 * TTL OR LSTTL UP TO 16 LSTTL LOADS 4 5 OR 4 TTL LOADS 1 * 0.1 μF BYPASS 2 Figure 15: LSTTL to CMOS Interface Circuit VCC2 HCPL-2201/11 (4.5 TO 20 V) HCPL-02XX HCNW22XX 80
Ω
* VCC1 (+5 V) 1 VCC 8 RL 1.1 k
Ω
120 pF* 2 7 CMOS DATA OUTPUT DATA INPUT 3 6 TTL OR LSTTL GND 4 5 TOTEM POLE 2 1 V R OUTPUT CC2 L * 120 pF PEAKING CAPACITOR GATE 5 V 1.1 k
Ω
MAY BE OMITTED AND 80
Ω
10 V 2.37 k RESISTOR MAY BE SHORTED
Ω
WHERE 500 ns PROPAGATION 15 V 3.83 k
Ω
DELAY IS SUFFICIENT. 20 V 5.11 k
Ω
**0.1 μF BYPASS
Broadcom AV02-0674EN 20 Document Outline Description Features Applications Functional Diagram Selection Guide Schematic Ordering Information Package Outline Drawings 8-Pin DIP Package (HCPL-2201/02/11/12/31/32) 8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-2201/02/11/12/31/32) Small-Outline SO-8 Package (HCPL-0201/11) 8-Pin Widebody DIP Package (HCNW2201/11) 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW2201/11) Solder Reflow Profile Regulatory Information Insulation and Safety Related Specifications IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (Option 060) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCNW22xx Option 060 ONLY) Absolute Maximum Ratings Recommended Operating Conditions Electrical Specifications Switching Specifications (AC) Package Characteristics