Datasheet TLE5x09A16(D) (Infineon) - 8

TLE5x09A16(D) Analog AMR/GMR Angle Sensor Functional description 1.2 Pin configuration
The sensitive area is located at the center of the chip.
16 15 14 13 12 11 10 9
Center of Sensitive Area
1 2 3 4 5 6 7 8 Figure 6 Pin configuration (top view) 1.3 Pin description
The top die is defined as die 1 and the bottom die as die 2. Single die sensors use the top die only.
Table 4 Pin description Pin No. Pin Name In/Out TLE5x09A16 - Function TLE5x09A16D - Function
1 V 1 O Die 1 bridge voltage proportional to Die 1 bridge voltage proportional to DIAG temperature. Diagnostic function temperature. Diagnostic function 2 V 1 Die 1 Supply voltage Die 1 Supply voltage DD 3 SIN_N1 O Die 1 Analog negative sine output Die 1 Analog negative sine output 4 SIN_P1 O Die 1 Analog positive sine output Die 1 Analog positive sine output 5 SIN_P2 O Not connected Die 2 Analog positive sine output 6 SIN_N2 O Not connected Die 2 Analog negative sine output 7 V 2 Not connected Die 2 Supply voltage DD 8 V 2 O Not connected Die 2 bridge voltage proportional to DIAG temperature. Diagnostic function 9 GND2 Not connected Die 2 Ground 10 GND2 Not connected Die 2 Ground 11 COS_N2 O Not connected Die 2 Analog negative cosine output 12 COS_P2 O Not connected Die 2 Analog positive cosine output 13 COS_P1 O Die 1 Analog positive cosine output Die 1 Analog positive cosine output 14 COS_N1 O Die 1 Analog negative cosine output Die 1 Analog negative cosine output 15 GND1 Die 1 Ground Die 1 Ground 16 GND1 Die 1 Ground Die 1 Ground Data Sheet 8 V 2.0 2018-12 Document Outline Features Functional Safety Product Validation Potential Applications Description Table of Contents 1 Functional description 1.1 General 1.2 Pin configuration 1.3 Pin description 1.4 Block diagram 1.5 Dual die angle output 2 Specification 2.1 Application circuit 2.2 Absolute maximum ratings 2.3 Sensor specification 2.3.1 Operating range 2.3.2 Electrical parameters 2.3.3 Output parameters 2.4 Error diagnosis 2.5 Angle performance 2.6 Electrostatic discharge protection 2.7 Electro magnetic compatibility (EMC) 3 Package information 3.1 Package parameters 3.2 Package outlines 3.3 Footprint 3.4 Packing 3.5 Marking 4 Revision history