HMC625BLP5E v02.0616 0.5 dB LSB GaAs MMIC 6-BIT DIGITALVARIABLE GAIN AMPLIFIER, DC - 5 GHzOutline Drawing T M L - S ITA IG NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] S - D 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. R PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. IE 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. LIF 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN. P Package Information M Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC625BLP5E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL3 [1] H625B XXXX IN A [1] Max peak reflow temperature of 260 °C A [2] 4-Digit lot number XXXX LE G B IA R A V For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D 6 Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Typical Performance Characteristics Maximum Gain vs. Frequency Normalized Attenuation [2 Input Return Loss [2] Output Return Loss [2] Bit Error vs. Frequency [2] Bit Error vs. Attenuation State [2] Normal Relative Phase vs. Frequency [2] Step Error vs. Frequency [2] Serial Control Interface Parallel Mode (Direct Parallel Mode & Latched Parallel Mode) Power-Up States PUP Truth Table Power-On Sequence Absolute Maximum Ratings Truth Table Bookmark 24 Bias Voltage Outline Drawing Package Information Pin Descriptions Application Circuit Evaluation PCB List of Materials for Evaluation PCB 116960 - HMC625ALP5 [1]
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