LTC3419 TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, VIN = 3.6V, unless otherwise noted.Load StepLoad StepLoad Step VOUT VOUT VOUT 100mV/DIV 100mV/DIV 100mV/DIV AC-COUPLED AC-COUPLED AC-COUPLED IL I I L L 500mA/DIV 500mA/DIV 500mA/DIV ILOAD ILOAD ILOAD 500mA/DIV 500mA/DIV 500mA/DIV 3419 G19 3419 G20 3419 G21 20μs/DIV 20μs/DIV 20μs/DIV VIN = 3.6V VIN = 3.6V VIN = 3.6V VOUT = 1.8V VOUT = 1.8V VOUT = 1.2V ILOAD = 0A TO 600mA ILOAD = 40mA TO 600mA ILOAD = 40mA TO 600mA PIN FUNCTIONS (DD/MS)VFB1 (Pin 1/Pin 1): Regulator 1 Output Feedback. Receives SW2 (Pin 6/Pin 8): Regulator 2 Switch Node Connection the feedback voltage from the external resistive divider to the Inductor. This pin swings from VIN to GND. across the regulator 1 output. Nominal voltage for this RUN2 (Pin 7/Pin 9): Regulator 2 Enable. Forcing this pin pin is 0.6V. to VIN enables regulator 2, while forcing it to GND causes RUN1 (Pin 2/Pin 2): Regulator 1 Enable. Forcing this pin regulator 2 to shut down. to VIN enables regulator 1, while forcing it to GND causes V regulator 1 to shut down. FB2 (Pin 8/Pin 10): Regulator 2 Output Feedback. Receives the feedback voltage from the external resistive divider MODE (Pin 3/Pin 3): Mode Select Input. To select pulse- across the regulator 2 output. Nominal voltage for this skipping mode, tie to VIN. Grounding this pin selects Burst pin is 0.6V. Mode operation. Do not leave this pin fl oating. Exposed Pad (Pin 9/NA): Ground. The Exposed Pad must SW1 (Pin 4/Pin 4): Regulator 1 Switch Node Connection be soldered to PCB for optimal thermal performance. to the Inductor. This pin swings from VIN to GND. GND (NA/Pins 5, 6): Ground. Connect to the (–) terminal VIN (Pin 5/Pin 7): Main Power Supply. Must be closely of COUT, and the (–) terminal of CIN. Pin 5 of the MS de-coupled to GND. package must be soldered to the PC board for optimal thermal performance. 3419fa 6