Datasheet LTC2051, LTC2052 (Analog Devices) - 10
| Производитель | Analog Devices |
| Описание | Dual/Quad Zero-Drift Operational Amplifiers |
| Страниц / Страница | 12 / 10 — PACKAGE DESCRIPTIO. MS8 Package. 8-Lead Plastic MSOP. MS Package. 10-Lead … |
| Формат / Размер файла | PDF / 148 Кб |
| Язык документа | английский |
PACKAGE DESCRIPTIO. MS8 Package. 8-Lead Plastic MSOP. MS Package. 10-Lead Plastic MSOP
21 предложений от 13 поставщиков Микросхема Буферный усилитель, LTC2051 - Dual Zero-Drift Operational Amplifiers; Package: DFN; Pins: 8; Temperature Range: 0°C to 70℃ |
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Текстовая версия документа
LTC2051/LTC2052
U PACKAGE DESCRIPTIO MS8 Package 8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660) DETAIL “A” 0.254 (.010) 0° – 6° TYP GAUGE PLANE 3.00 ± 0.102 0.52 0.53 (.118 ± 0.152 ± .004) (.0205) (.021 (NOTE 3) ± .006) 1.10 0.86 8 7 6 5 0.889 ± 0.127 (.043) (.034) REF DETAIL “A” (.035 ± .005) MAX REF 0.18 (.007) 3.00 4.90 ± 0.102 ± 0.152 SEATING (.118 (.193 ± .004) ± .006) 5.23 3.20 – 3.45 PLANE (NOTE 4) (.206) 0.22 – 0.38 0.127 ± 0.076 MIN (.126 – .136) (.009 – .015) (.005 ± .003) TYP 0.65 NOTE: (.0256) 1. DIMENSIONS IN MILLIMETER/(INCH) BSC 1 2 3 4 2. DRAWING NOT TO SCALE 0.42 ± 0.038 0.65 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. (.0165 ± .0015) (.0256) MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE TYP BSC 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. RECOMMENDED SOLDER PAD LAYOUT INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE MSOP (MS8) 0204 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
MS Package 10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661) 3.00 ± 0.102 (.118 ± .004) 0.497 ± 0.076 (NOTE 3) (.0196 ± .003) 10 9 8 7 6 0.889 REF ± 0.127 (.035 ± .005) 3.00 4.90 ± 0.152 ± 0.102 DETAIL “A” (.118 (.193 ± .006) ± .004) 5.23 0.254 (NOTE 4) (.206) 3.20 – 3.45 (.010) (.126 – .136) 0° – 6° TYP MIN GAUGE PLANE 1 2 3 4 5 0.53 ± 0.152 0.305 ± 0.038 0.50 (.0120 (.0197) (.021 ± .0015) ± .006) 1.10 0.86 TYP BSC (.043) (.034) DETAIL “A” RECOMMENDED SOLDER PAD LAYOUT MAX REF 0.18 MSOP (MS) 0603 (.007) SEATING PLANE 0.17 – 0.27 0.127 ± 0.076 (.007 – .011) (.005 ± .003) 0.50 TYP (.0197) NOTE: BSC 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 20512fd 10
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