BGA Package221-Lead (15mm × 11.25mm × 2.82mm) (Reference LTC DWG# 05-08-1886 Rev C) A Z SEE NOTES DETAIL A aaa Z E Y 7 X A2 SEE NOTES 13 12 11 10 9 8 7 6 5 4 3 2 1 PIN 1 3 Z A A1 PIN “A1” B ccc Z CORNER C 4 b D E b1 MOLD F CAP SUBSTRATE G H1 H H2 D F J DETAIL B // bbb Z K L M Øb (221 PLACES) e N ddd M Z X Y eee M Z P Q R S aaa Z e b PACKAGE TOP VIEW DETAIL A G DETAIL B PACKAGE BOTTOM VIEW 4.25 3.75 PACKAGE SIDE VIEW NOTES: 4.80 4.00 3.20 2.40 1.60 0.80 0.00 0.80 1.60 2.40 3.20 4.00 4.80 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 0.40 ±0.025 Ø 221x 6.40 2. ALL DIMENSIONS ARE IN MILLIMETERS DIMENSIONS 5.60 BALL DESIGNA 3 TION PER JESD MS-028 AND JEP95 SYMBOLMINNOMMAXNOTES 4.80 A 2.67 2.82 2.97 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. 4.00 A1 0.35 0.40 0.45 BALL HT THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR A2 2.32 2.42 2.52 3.20 MARKED FEATURE b 0.45 0.50 0.55 BALL DIMENSION 2.40 5. PRIMARY DATUM -Z- IS SEATING PLANE b1 0.37 0.40 0.43 PAD DIMENSION 1.60 D 15.0 6 PACKAGE ROW AND COLUMN LABELING MAY VARY ! AMONG µModule PRODUCTS. REVIEW EACH PACKAGE 0.80 E 11.25 LAYOUT CAREFULLY e 0.80 0.00 F 12.80 0.80 G 9.60 1.60 H1 0.37 0.42 0.47 SUBSTRATE THK 2.40 H2 1.95 2.00 2.05 MOLD CAP HT aaa 0.15 3.20 bbb 0.10 LTMXXXXXX 4.00 ccc 0.12 µModule 4.80 ddd 0.15 COMPONENT 5.35 eee 0.08 PIN “A1” 5.60 5.85 TOTAL NUMBER OF BALLS: 221 6.40 TRAY PIN 1 BEVEL SUGGESTED PCB LAYOUT PACKAGE IN TRAY LOADING ORIENTATION BGA 221 0517 REV C TOP VIEW
