Datasheet AD589 (Analog Devices) - 4

AD589 ABSOLUTE MAXIMUM RATINGS AD589 CHIP DIMENSIONS AND PAD LAYOUT
Current . 10 mA Reverse Current . 10 mA Power Dissipation* . 125 mW Storage Temperature . –65°C to +175°C Operating Junction Temperature Range . –55°C to +150°C Lead Temperature (Soldering, 10 sec) . .300°C
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*Absolute maximum power dissipation is limited by maximum current through the device. Maximum rating at elevated temperatures must be computed assuming TJ T  150°C and JA = 400 = C/W.
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
C) Package Description Package Option Reel/Tray Range (

C)
AD589JH 100 Metal Can (TO-51) H-02 100 0 to +70 AD589JR 100 SOIC-8 R-8 98 0 to +70 AD589JRZ* 100 SOIC-8 R-8 98 0 to +70 AD589JR-REEL 100 SOIC-8 R-8 2,500 0 to +70 AD589JRZ-REEL* 100 SOIC-8 R-8 2,500 0 to +70 AD589JCHIPS 100 DICE — 25 0 to +70 AD589KH 50 Metal Can (TO-51) H-02 100 0 to +70 AD589LH 25 Metal Can (TO-51) H-02 100 0 to +70 AD589MH 10 Metal Can (TO-51) H-02 100 0 to +70 AD589SH 100 Metal Can (TO-51) H-02 100 –55 to +125 AD589SH/883B 100 Metal Can (TO-51) H-02 100 –55 to +125 AD589TH 50 Metal Can (TO-51) H-02 100 –55 to +125 AD589TH/883B 50 Metal Can (TO-51) H-02 100 –55 to +125 AD589TCHIPS 50 DICE — 25 –55 to +125 *Z = Pb-free part
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily ac cu mu late on the human body and test equipment and can discharge without detection. Although the AD589 features proprietary ESD pro tec tion circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD pre cau tions are rec om mend ed to avoid per for mance deg ra da tion or loss of functionality. REV. C –3– Document Outline FEATURES PRODUCT DESCRIPTION FUNCTIONAL BLOCK DIAGRAMS PRODUCT HIGHLIGHTS SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS AD589 CHIP DIMENSIONS AND PAD LAYOUT ORDERING GUIDE UNDERSTANDING THE SPECIFICATIONS Voltage Variation Versus Temperature Dynamic Performance APPLICATION INFORMATION OUTLINE DIMENSIONS Revision History