AD9231Data SheetPIN CONFIGURATION AND FUNCTION DESCRIPTIONSBSEAADDDDDDDDASEFDDDDDDDDVVIN+IN–BVVCMVVIN–IN+VVAAVVAARBIVSENVRAAVVAA64636261605958575655545352515049CLK+1PIN 148 PDWNINDICATORCLK–247 OEBSYNC346 CSBNC445 SCLK/DFSNC544 SDIO/DCSNC643 ORANC7AD923142 D11A (MSB)(LSB) D0B841 D10ATOP VIEWD1B940 D9A(Not to Scale)DRVDD 1039 D8AD2B 1138 D7AD3B 1237 DRVDDD4B 1336 D6AD5B 1435 D5AD6B 1534 D4AD7B 1633 D3A17181920212223242526272829303132BAAAADD1BRBNCNCNCDDNC0D8BD9BV1OVD1D2RD10BDCODCOR) DD) DDSB 005 (L(MSB 08121- NOTES 1. NC = NO CONNECT. 2. THE EXPOSED PADDLE MUST BE SOLDERED TO THE PCB GROUND TO ENSURE PROPER HEAT DISSIPATION, NOISE, AND MECHANICAL STRENGTH BENEFITS. Figure 5. Pin Configuration Table 8. Pin Function Description Pin No.MnemonicDescription 0 GND Exposed paddle is the only ground connection for the chip. Must be connected to PCB AGND. 1, 2 CLK+, CLK− Differential Encode Clock. PECL, LVDS, or 1.8 V CMOS inputs. 3 SYNC Digital Input. SYNC input to clock divider. 30 kΩ internal pull-down. 4, 5, 6, 7, 25, 26, 27, 29 NC Do Not Connect. 8 to 9, 11 to 18, 20, 21 D0B to D11B Channel B Digital Outputs. D11B = MSB. 10, 19, 28, 37 DRVDD Digital Output Driver Supply (1.8 V to 3.3 V). 22 ORB Channel B Out-of-Range Digital Output. 23 DCOB Channel B Data Clock Digital Output. 24 DCOA Channel A Data Clock Digital Output. 30 to 36, 38 to 42 D0A to D11A Channel A Digital Outputs. D11A = MSB. 43 ORA Channel A Out-of-Range Digital Output. 44 SDIO/DCS SPI Data Input/Output (SDIO). Bidirectional SPI Data I/O in SPI mode. 30 kΩ internal pull- down in SPI mode. Duty Cycle Stabilizer (DCS). Static enable input for duty cycle stabilizer in non-SPI mode. 30 kΩ internal pull-up in non-SPI (DCS) mode. 45 SCLK/DFS SPI Clock (SCLK) Input in SPI mode. 30 kΩ internal pul -down. Data Format Select (DFS). Static control of data output format in non-SPI mode. 30 kΩ internal pull-down. DFS high = twos complement output. DFS low = offset binary output. 46 CSB SPI Chip Select. Active low enable; 30 kΩ internal pull-up. 47 OEB Digital Input. Enable Channel A and Channel B digital outputs if low, tristate outputs if high. 30 kΩ internal pull-down. 48 PDWN Digital Input. 30 kΩ internal pull-down. PDWN high = power-down device. PDWN low = run device, normal operation. Rev. B | Page 10 of 36 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM PRODUCT HIGHLIGHTS REVISION HISTORY GENERAL DESCRIPTION SPECIFICATIONS DC SPECIFICATIONS AC SPECIFICATIONS DIGITAL SPECIFICATIONS SWITCHING SPECIFICATIONS TIMING SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL CHARACTERISTICS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS AD9231-80 AD9231-65 AD9231-40 AD9231-20 EQUIVALENT CIRCUITS THEORY OF OPERATION ADC ARCHITECTURE ANALOG INPUT CONSIDERATIONS Input Common Mode Differential Input Configurations Single-Ended Input Configuration VOLTAGE REFERENCE Internal Reference Connection External Reference Operation CLOCK INPUT CONSIDERATIONS Clock Input Options Input Clock Divider Clock Duty Cycle Jitter Considerations CHANNEL/CHIP SYNCHRONIZATION POWER DISSIPATION AND STANDBY MODE DIGITAL OUTPUTS Digital Output Enable Function (OEB) TIMING Data Clock Output (DCO) BUILT-IN SELF-TEST (BIST) AND OUTPUT TEST BUILT-IN SELF-TEST (BIST) OUTPUT TEST MODES SERIAL PORT INTERFACE (SPI) CONFIGURATION USING THE SPI HARDWARE INTERFACE CONFIGURATION WITHOUT THE SPI SPI ACCESSIBLE FEATURES MEMORY MAP READING THE MEMORY MAP REGISTER TABLE OPEN LOCATIONS DEFAULT VALUES Logic Levels Transfer Register Map Channel-Specific Registers MEMORY MAP REGISTER TABLE MEMORY MAP REGISTER DESCRIPTIONS Sync Control (Register 0x100) Bits[7:3]—Reserved Bit 2—Clock Divider Next Sync Only Bit 1—Clock Divider Sync Enable Bit 0—Master Sync Enable Bit 7—Enable OEB Pin 47 Bit 3—Enable GCLK Detect Bit 2—Run GCLK Bit 0—Disable SDIO Pull-Down APPLICATIONS INFORMATION DESIGN GUIDELINES Power and Ground Recommendations Exposed Paddle Thermal Heat Sink Recommendations VCM RBIAS Reference Decoupling SPI Port OUTLINE DIMENSIONS ORDERING GUIDE