Корпус Intersil L12.3x3Z — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
L12.3x3Z
12 LEAD THIN QUAD FLAT NO LEAD PLASTIC PACKAGE FOR ISL99202 USE ONLY WITH REDUCED e-PAD SIZE TO 1.4mm ON LAND PATTERN
Rev 0, 10/08
3.00 0.5
BSC A
B 6
12 10 PIN #1 INDEX AREA 6 3.00 4X 1.70 REF PIN 1
INDEX AREA
9 1 7
3
0.10 M C A B
(4X) 0.15 4
6 0.25 +0.07 / -0.05 4 12X 0 . 4 В± 0 . 1 TOP VIEW BOTTOM VIEW SEE DETAIL "X"
0.10 C 0 . 75 C BASE PLANE ( 2 . 8 TYP )
1.40 ) SEATING PLANE
0.08 C ( SIDE VIEW 0.6 C 0 . 50 0 . 2 REF 5 0 . 00 MIN.
0 . 05 MAX. 0 . 25 TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to JEDEC STD MO-229.
3. Unless otherwise specified, tolerance : Decimal В± 0.05
4. Dimension b applies to the metallized terminal and is measured …