Datasheet Texas Instruments SN54LS73A — Даташит

Производитель	Texas Instruments
Серия	SN54LS73A

Datasheets

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Корпус / Упаковка / Маркировка

Параметры

Parameters / Models	5962-9675101QCA	5962-9675101QDA	SN54LS73AJ	SNJ54LS73AJ	SNJ54LS73AW
Bits	2	2	2	2	2
F @ Nom Voltage(Max), Mhz	35	35	35	35	35
ICC @ Nom Voltage(Max), мА	6	6	6	6	6
Тип входа	TTL	TTL	TTL	TTL	TTL
Рабочий диапазон температур, C	от -55 до 125	от -55 до 125	от -55 до 125	от -55 до 125	от -55 до 125
Output Drive (IOL/IOH)(Max), мА	-0.4/8	-0.4/8	-0.4/8	-0.4/8	-0.4/8
Тип выхода	TTL	TTL	TTL	TTL	TTL
Package Group	CDIP	CFP	CDIP	CDIP	CFP
Package Size: mm2:W x L, PKG	See datasheet (CDIP)	See datasheet (CFP)	See datasheet (CDIP)	See datasheet (CDIP)	See datasheet (CFP)
Rating	Military	Military	Military	Military	Military
Technology Family	LS	LS	LS	LS	LS
VCC(Max), В	5.25	5.25	5.25	5.25	5.25
VCC(Min), В	4.75	4.75	4.75	4.75	4.75
tpd @ Nom Voltage(Max), нс	20	20	20	20	20

Экологический статус

Application Notes

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  Input and Output Characteristics of Digital Integrated Circuits
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  This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
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  TI IBIS File Creation Validation and Distribution Processes
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  The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
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  Live Insertion
  PDF, 150 Кб, Файл опубликован: 1 окт 1996
  Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
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  Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
  PDF, 337 Кб, Файл опубликован: 8 июл 2004
  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
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  Designing With Logic (Rev. C)
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  Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
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  PDF, 118 Кб, Версия: A, Файл опубликован: 1 мар 1997
  The Texas Instruments (TI) SN54/74LS123 dual retriggerable monostable multivibrator is a one-shot device capable of verylong output pulses and up to 100% duty cycle. The ?LS123 also features dc triggering from gated low-level active A andhigh-level active B inputs and provides a clear input that terminates the output pulse of any predetermined time independentof timing components R ext and
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  Introduction to Logic
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Модельный ряд

Классификация производителя

• Semiconductors> Space & High Reliability> Logic Products> Flip-Flop/Latch/Registers