Datasheet Texas Instruments SN54BCT623 — Даташит
| Производитель | Texas Instruments |
| Серия | SN54BCT623 |
Восьмеричные шинные трансиверы с выходами с 3 состояниями
Datasheets
Octal Bus Transceivers With 3-State Outputs datasheet
PDF, 150 Кб, Версия: A, Файл опубликован: 1 ноя 1993
Выписка из документа
Цены
OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS | |||
| SN54BCT623J Texas Instruments | по запросу | ||
| SN54BCT623W Texas Instruments | по запросу | ||
| SN54BCT623_07 Texas Instruments | по запросу | ||
| SN54BCT623 Texas Instruments | по запросу | ||
Статус
| 5962-9094001MRA | SNJ54BCT623J | |
|---|---|---|
| Статус продукта | В производстве | В производстве |
| Доступность образцов у производителя | Нет | Нет |
Корпус / Упаковка / Маркировка
| 5962-9094001MRA | SNJ54BCT623J | |
|---|---|---|
| N | 1 | 2 |
| Pin | 20 | 20 |
| Package Type | J | J |
| Industry STD Term | CDIP | CDIP |
| JEDEC Code | R-GDIP-T | R-GDIP-T |
| Package QTY | 1 | 1 |
| Carrier | TUBE | TUBE |
| Width (мм) | 6.92 | 6.92 |
| Length (мм) | 24.2 | 24.2 |
| Thickness (мм) | 4.57 | 4.57 |
| Pitch (мм) | 2.54 | 2.54 |
| Max Height (мм) | 5.08 | 5.08 |
| Mechanical Data | Скачать | Скачать |
| Маркировка | 5962-9094001MR |
Параметры
| Parameters / Models | 5962-9094001MRA | SNJ54BCT623J |
|---|---|---|
| Bits | 8 | 8 |
| Рабочий диапазон температур, C | от -55 до 125 | от -55 до 125 |
| Package Group | CDIP | CDIP |
| Package Size: mm2:W x L, PKG | See datasheet (CDIP) | See datasheet (CDIP) |
| Rating | Military | Military |
| Schmitt Trigger | No | No |
| Technology Family | BCT | BCT |
| VCC(Max), В | 5.5 | 5.5 |
| VCC(Min), В | 4.5 | 4.5 |
Экологический статус
| 5962-9094001MRA | SNJ54BCT623J | |
|---|---|---|
| RoHS | See ti.com | See ti.com |
Application Notes
- Input and Output Characteristics of Digital Integrated CircuitsPDF, 1.7 Мб, Файл опубликован: 1 окт 1996
This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou - TI IBIS File Creation Validation and Distribution ProcessesPDF, 380 Кб, Файл опубликован: 29 авг 2002
The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con - Live InsertionPDF, 150 Кб, Файл опубликован: 1 окт 1996
Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha - Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)PDF, 105 Кб, Версия: A, Файл опубликован: 1 авг 1997
The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi - Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)PDF, 614 Кб, Версия: C, Файл опубликован: 2 дек 2015
- Semiconductor Packing Material Electrostatic Discharge (ESD) ProtectionPDF, 337 Кб, Файл опубликован: 8 июл 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge - Designing With Logic (Rev. C)PDF, 186 Кб, Версия: C, Файл опубликован: 1 июн 1997
Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w - Introduction to LogicPDF, 93 Кб, Файл опубликован: 30 апр 2015
- Implications of Slow or Floating CMOS Inputs (Rev. D)PDF, 260 Кб, Версия: D, Файл опубликован: 23 июн 2016
Модельный ряд
Серия: SN54BCT623 (2)
Классификация производителя
- Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Transceivers
