Реле Tianbo - ресурс 10 млн переключений

Datasheet Texas Instruments 5962-9685301Q2A — Даташит

ПроизводительTexas Instruments
СерияSN54AHCT574
Модель5962-9685301Q2A
Datasheet Texas Instruments 5962-9685301Q2A

Восьмеричные триггеры D-типа с триггером по фронту и выходами с 3 состояниями 20-LCCC от -55 до 125

Datasheets

SNx4AHCT574 Octal Transparent D-Type Latches With 3-State Outputs datasheet
PDF, 1.5 Мб, Версия: M, Файл опубликован: 3 сен 2014
Выписка из документа

Цены

5 предложений от 5 поставщиков
Octal Edge-Triggered D-type Flip-Flops With 3-State Outputs 20-LCCC -55 to 125
T-electron
Россия и страны СНГ
5962-9685301Q2A
Texas Instruments
2 372 ₽
AiPCBA
Весь мир
5962-9685301Q2A
Texas Instruments
3 803 ₽
ChipWorker
Весь мир
5962-9685301Q2A
Texas Instruments
4 348 ₽
TradeElectronics
Россия
5962-9685301Q2A
Texas Instruments
по запросу
Вебинар «Как выбрать идеальный силовой модуль: решения SUNCO для силовой электроники» (03.12.2024)

Статус

Статус продуктаВ производстве (Рекомендуется для новых разработок)
Доступность образцов у производителяНет

Корпус / Упаковка / Маркировка

Pin20202020
Package TypeFKFKFKFK
Industry STD TermLCCCLCCCLCCCLCCC
JEDEC CodeS-CQCC-NS-CQCC-NS-CQCC-NS-CQCC-N
Package QTY1111
CarrierTUBETUBETUBETUBE
Маркировка9685301Q2ASNJ54AHCT574FK5962-
Width (мм)8.898.898.898.89
Length (мм)8.898.898.898.89
Thickness (мм)1.831.831.831.83
Pitch (мм)1.271.271.271.27
Max Height (мм)2.032.032.032.03
Mechanical DataСкачатьСкачатьСкачатьСкачать

Параметры

3-State OutputYes
Bits8
F @ Nom Voltage(Max)70 Mhz
ICC @ Nom Voltage(Max)0.04 мА
Тип входаTTL
Рабочий диапазон температурот -55 до 125 C
Output Drive (IOL/IOH)(Max)8/-8 мА
Тип выходаCMOS
Package GroupLCCC
Package Size: mm2:W x L20LCCC: 79 mm2: 8.89 x 8.89(LCCC) PKG
RatingMilitary
Technology FamilyAHCT
VCC(Max)5.5 В
VCC(Min)4.5 В
tpd @ Nom Voltage(Max)12 нс

Экологический статус

RoHSSee ti.com

Application Notes

  • How to Select Little Logic (Rev. A)
    PDF, 1.1 Мб, Версия: A, Файл опубликован: 26 июл 2016
    TI Little Logic devices are logic-gate devices assembled in a small single- dual- or triple- gate package. Little Logic devices are widely used in portable equipment such as mobile phones MP3 players and notebook computers. Little Logic devices also are used in desktop computers and telecommunications. Little Logic gates are common components for easy PC board routing schematic design and b
  • Advanced High-Speed CMOS (AHC) Logic Family (Rev. C)
    PDF, 102 Кб, Версия: C, Файл опубликован: 2 дек 2002
    The Texas Instruments (TI) advanced high-speed CMOS (AHC) logic family provides a natural migration for high-speed CMOS (HCMOS) users who need more speed for low-power and low-drive applications. Unlike many other advanced logic families AHC does not have the drawbacks that come with higher speed e.g. higher signal noise and power consumption. The AHC logic family consists of gates medium-sca
  • Power-Up Behavior of Clocked Devices (Rev. A)
    PDF, 34 Кб, Версия: A, Файл опубликован: 6 фев 2015
  • Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices
    PDF, 115 Кб, Файл опубликован: 1 дек 1997
    This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Кб, Файл опубликован: 29 авг 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Live Insertion
    PDF, 150 Кб, Файл опубликован: 1 окт 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Кб, Версия: A, Файл опубликован: 1 авг 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Texas Instruments Little Logic Application Report
    PDF, 359 Кб, Файл опубликован: 1 ноя 2002
    Portable and consumer electronic systems? needs present greater challenges today than ever before. Engineers strive to design smaller faster lower-cost systems to meet the market demand. Consequently the semiconductor industry faces a growing need to increase operating speed minimize power consumption and reduce packaging size. Texas Instruments manufactures a variety of Little Logic semicond
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Кб, Версия: C, Файл опубликован: 2 дек 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Кб, Файл опубликован: 8 июл 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Selecting the Right Level Translation Solution (Rev. A)
    PDF, 313 Кб, Версия: A, Файл опубликован: 22 июн 2004
    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
  • Introduction to Logic
    PDF, 93 Кб, Файл опубликован: 30 апр 2015
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Кб, Версия: D, Файл опубликован: 23 июн 2016
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Кб, Версия: B, Файл опубликован: 1 июн 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale

Модельный ряд

Классификация производителя

  • Semiconductors > Space & High Reliability > Logic Products > Flip-Flop/Latch/Registers

Варианты написания:

59629685301Q2A, 5962 9685301Q2A

На английском языке: Datasheet Texas Instruments 5962-9685301Q2A

Электронные компоненты. Скидки, кэшбэк и бесплатная доставка от ТМ Электроникс