Клеммные колодки Keen Side

Datasheet Texas Instruments 5962-8755501SA — Даташит

ПроизводительTexas Instruments
СерияSN54AC373
Модель5962-8755501SA
Datasheet Texas Instruments 5962-8755501SA

Восьмеричные прозрачные защелки типа D с выходами с 3 состояниями 20-CFP от -55 до 125

Datasheets

SN54AC373, SN74AC373 datasheet
PDF, 1.4 Мб, Версия: D, Файл опубликован: 23 окт 2003
Выписка из документа

Цены

5 предложений от 5 поставщиков
Octal D-type Transparent Latches With 3-State Outputs 20-CFP -55 to 125
T-electron
Россия и страны СНГ
5962-8755501SA
Texas Instruments
2 079 ₽
AiPCBA
Весь мир
5962-8755501SA
Texas Instruments
2 271 ₽
ChipWorker
Весь мир
5962-8755501SA
Texas Instruments
3 345 ₽
5962-8755501SA
Texas Instruments
по запросу
LED-драйверы MOSO для индустриальных приложений

Статус

Статус продуктаВ производстве (Рекомендуется для новых разработок)
Доступность образцов у производителяНет

Корпус / Упаковка / Маркировка

Pin20
Package TypeW
Industry STD TermCFP
JEDEC CodeR-GDFP-F
Package QTY1
CarrierTUBE
Width (мм)6.92
Length (мм)13.09
Thickness (мм)1.84
Pitch (мм)1.27
Max Height (мм)2.45
Mechanical DataСкачать

Параметры

3-State OutputYes
Bits8
F @ Nom Voltage(Max)100 Mhz
ICC @ Nom Voltage(Max)0.08 мА
Тип входаCMOS
Рабочий диапазон температурот -55 до 125 C
Output Drive (IOL/IOH)(Max)24/-24 мА
Тип выходаCMOS
Package GroupCFP
Package Size: mm2:W x LSee datasheet (CFP) PKG
RatingMilitary
Technology FamilyAC
VCC(Max)6 В
VCC(Min)2 В
tpd @ Nom Voltage(Max)15,10.5 нс

Экологический статус

RoHSSee ti.com

Application Notes

  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Кб, Файл опубликован: 8 июл 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Introduction to Logic
    PDF, 93 Кб, Файл опубликован: 30 апр 2015
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Кб, Версия: C, Файл опубликован: 2 дек 2015
  • Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
    PDF, 43 Кб, Файл опубликован: 1 апр 1996
    Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren
  • Live Insertion
    PDF, 150 Кб, Файл опубликован: 1 окт 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Power-Up Behavior of Clocked Devices (Rev. A)
    PDF, 34 Кб, Версия: A, Файл опубликован: 6 фев 2015
  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Мб, Файл опубликован: 1 окт 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Designing With Logic (Rev. C)
    PDF, 186 Кб, Версия: C, Файл опубликован: 1 июн 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Кб, Версия: B, Файл опубликован: 1 июн 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Кб, Версия: D, Файл опубликован: 23 июн 2016
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Кб, Файл опубликован: 29 авг 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con

Модельный ряд

Классификация производителя

  • Semiconductors > Space & High Reliability > Logic Products > Flip-Flop/Latch/Registers

Варианты написания:

59628755501SA, 5962 8755501SA

На английском языке: Datasheet Texas Instruments 5962-8755501SA

Электронные компоненты. Скидки, кэшбэк и бесплатная доставка от ТМ Электроникс