Datasheet Texas Instruments LMZ31503 — Даташит

Производитель	Texas Instruments
Серия	LMZ31503

Datasheets

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Купить LMZ31503 на РадиоЛоцман.Цены — от 415 до 1 515 ₽ 31 предложений от 13 поставщиков Источники питания - Для монтажа на плату Преобразователи DC/DC
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ЗУМ-СМД Россия	LMZ31503RUQR Texas Instruments	по запросу	Купить

Статус

Корпус / Упаковка / Маркировка

Параметры

Parameters / Models	LMZ31503RUQR	LMZ31503RUQT
Iout(Max), A	3	3
Рабочий диапазон температур, C	от -40 до 85	от -40 до 85
Package Size: mm2:W x L, PKG	47B1QFN: 135 mm2: 9 x 15(B1QFN)	47B1QFN: 135 mm2: 9 x 15(B1QFN)
Package Type	QFN	QFN
Regulated Outputs	1	1
Soft Start	Adjustable	Adjustable
Special Features	EMI Tested,Enable,Frequency Synchronization,Power Good,Remote Sense,Tracking	EMI Tested,Enable,Frequency Synchronization,Power Good,Remote Sense,Tracking
Switching Frequency(Max), kHz	780	780
Switching Frequency(Min), kHz	330	330
Switching Frequency(Typ), kHz	500	500
Vin(Max), В	14.5	14.5
Vin(Min), В	4.5	4.5
Vout(Max), В	5.5	5.5
Vout(Min), В	0.8	0.8

Экологический статус

Application Notes

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  Powering LMZ3 SIMPLE SWITCHER Power Modules From 3.3 V
  PDF, 38 Кб, Файл опубликован: 2 июл 2013
  LMZ31503 Powering LMZ3 SIMPLE SWITCHERВ® Power Modules from 3.3V
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  Adjusting LMZ3 Output Voltage with LM10010/1
  PDF, 87 Кб, Файл опубликован: 11 фев 2014
  ThisapplicationnoteoutlinesthemethodstopairanLMZ3powermodulewithanLM10010/1VIDvoltageprogrammertoadjusttheoutputvoltage.TheLMZ3powermoduleisaneasy-to-useintegratedpowersolutionwhichcombinesaDC/DCconverterwithpowerMOSFETs,ashieldedinductor,andpassivecomponentsintoalowprofileQFNpackage,whilest
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  Working With QFN Power Modules (Rev. A)
  PDF, 1.7 Мб, Версия: A, Файл опубликован: 8 июн 2017
  TexasInstrumentsQuadFlatpackNo-lead(QFN)powermodulesallowfor boardminiaturization,and holdseveraladvantagesoverotherpowermodulepackages.The QFNpackageshavehigherpowerdensity,asmallerroutingarea,improvedthermalperformance,and improvedelectricalparasitics.Additionally,theabsenceof externalleadseliminatesbent-leadconc
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  Soldering Requirements for BQFN Packages (Rev. B)
  PDF, 737 Кб, Версия: B, Файл опубликован: 8 июн 2017
  This documentoutlinesthe solderingrequirementsfor the TPS84and LMZ3devicefamilies
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  Uninterruptible Synchronization Clock Circuit
  PDF, 74 Кб, Файл опубликован: 22 ноя 2013
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  Understanding and Applying Current-Mode Control Theory
  PDF, 409 Кб, Файл опубликован: 19 авг 2007
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  AN-643 EMI/RFI Board Design (Rev. B)
  PDF, 742 Кб, Версия: B, Файл опубликован: 3 май 2004
  Application Note 643 EMI/RFI Board Design
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  AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
  PDF, 2.7 Мб, Версия: A, Файл опубликован: 23 апр 2013
  This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
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  AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
  PDF, 82 Кб, Версия: C, Файл опубликован: 23 апр 2013
  When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
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  AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
  PDF, 9.2 Мб, Версия: B, Файл опубликован: 23 апр 2013
  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
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  AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
  PDF, 3.6 Мб, Версия: A, Файл опубликован: 23 апр 2013
  This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
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  AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
  PDF, 374 Кб, Версия: C, Файл опубликован: 23 апр 2013
  This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
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  AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
  PDF, 2.5 Мб, Версия: C, Файл опубликован: 24 апр 2013
  Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
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  Semiconductor and IC Package Thermal Metrics (Rev. C)
  PDF, 201 Кб, Версия: C, Файл опубликован: 19 апр 2016
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  QFN and SON PCB Attachment (Rev. B)
  PDF, 821 Кб, Версия: B, Файл опубликован: 24 авг 2018
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  Input and Output Capacitor Selection
  PDF, 219 Кб, Файл опубликован: 19 сен 2005

Модельный ряд

Классификация производителя

• Semiconductors> Power Management> Power Modules> Non-Isolated Module> Step-Down (Buck) Module