Datasheet Texas Instruments AM5728 — Даташит

Производитель	Texas Instruments
Серия	AM5728

Datasheets

Цены

Купить AM5728 на РадиоЛоцман.Цены — от 11 до 11 679 ₽ 27 предложений от 14 поставщиков Микросхема Микроконтроллер, MPU AM572x RISC 32Bit 1500MHz 1.8V/3.3V 760Pin FC-BGA Tray
ЧипСити Россия	AM5728BABCX Texas Instruments	1 608 ₽	Купить
AiPCBA Весь мир	AM5728BABCXEA Texas Instruments	2 133 ₽	Купить
Lixinc Electronics Весь мир	AM5728BABCX Texas Instruments	от 5 476 ₽	Купить
ЭИК Россия	AM5728BABCX Texas Instruments	от 11 673 ₽	Купить

Статус

Корпус / Упаковка / Маркировка

Параметры

Parameters / Models	AM5728BABCX	AM5728BABCXA	AM5728BABCXEA	XAM5728AABCXE	XAM5728BABCXE
ARM CPU	2 ARM Cortex-A15	2 ARM Cortex-A15	2 ARM Cortex-A15	2 ARM Cortex-A15	2 ARM Cortex-A15
ARM MHz, Max.	1500	1500	1500
ARM MHz (Max.)				1500	1500
ARM MIPS, Max.	10500	10500	10500
ARM MIPS(Max.)				10500	10500
Application	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment Enterprise Systems Industrial Personal Electronics	Communications Equipment Enterprise Systems Industrial Personal Electronics
Approx. Price (US$)				40.47 | 1ku	40.47 | 1ku
CAN	2	2	2
CAN(#)				2	2
Co-Processor, s	2 ARM Cortex-M4,4 PRU-ICSS	2 ARM Cortex-M4,4 PRU-ICSS	2 ARM Cortex-M4,4 PRU-ICSS
Co-Processor(s)				2 ARM Cortex-M4 4 PRU-ICSS	2 ARM Cortex-M4 4 PRU-ICSS
DMA, Ch	64-Ch EDMA	64-Ch EDMA	64-Ch EDMA
DMA(Ch)				64-Ch EDMA	64-Ch EDMA
DRAM	DDR3,DDR3L	DDR3,DDR3L	DDR3,DDR3L	DDR3(L)	DDR3(L)
DSP	2 C66x	2 C66x	2 C66x	2 C66x	2 C66x
DSP MHz, Max.	750	750	750
DSP MHz (Max.)				750	750
Display Options	1 HDMI out,3 LCD out	1 HDMI out,3 LCD out	1 HDMI out,3 LCD out	1 HDMI out 3 LCD out	1 HDMI out 3 LCD out
EMAC	10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC	10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC	10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC	10/100/1000 2-Port 1Gb Switch	10/100/1000 2-Port 1Gb Switch
General Purpose Memory	1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)	1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)	1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)	1 16-bit (GPMC NAND flash NOR Flash SRAM)	1 16-bit (GPMC NAND flash NOR Flash SRAM)
Graphics Acceleration	2 3D,1 2D	2 3D,1 2D	2 3D,1 2D	2 3D 1 2D	2 3D 1 2D
HDMI	1	1	1	1	1
I2C	5	5	5	5	5
IO Supply, В	1.8,3.3	1.8,3.3	1.8,3.3
IO Supply(V)				1.8 3.3	1.8 3.3
Industrial Protocols	1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III	1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III	1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III	1588 EtherCAT EtherNet/IP POWERLINK PROFIBUS PROFINET RT/IRT SERCOS III	1588 EtherCAT EtherNet/IP POWERLINK PROFIBUS PROFINET RT/IRT SERCOS III
LCD	3	3	3	3	3
MMC/SD	4	4	4	4	4
McASP	8	8	8	8	8
On-Chip L1 Cache	32KB (L1D and L1I ARM Cortex-A15)	32KB (L1D and L1I ARM Cortex-A15)	32KB (L1D and L1I ARM Cortex-A15)	32 KB (ARM Cortex-A15) 32 KB (C66x)	32 KB (ARM Cortex-A15) 32 KB (C66x)
On-Chip L2 Cache	2MB (ARM Coxtex-A15)	2MB (ARM Coxtex-A15)	2MB (ARM Coxtex-A15)	1 MB (ARM Cortex-A15) 288 KB (C66x)	1 MB (ARM Cortex-A15) 288 KB (C66x)
Operating Systems	Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE	Android Integrity Linux Nucleus Neutrino TI-RTOS VxWorks Windows Embedded CE	Android Integrity Linux Nucleus Neutrino TI-RTOS VxWorks Windows Embedded CE
Рабочий диапазон температур, C	от -40 до 105,0 до 90	от -40 до 105,0 до 90	от -40 до 105,0 до 90
Operating Temperature Range(C)				-40 to 105 0 to 90	-40 to 105 0 to 90
Other Hardware Acceleration	Crypto Accelerator	Crypto Accelerator	Crypto Accelerator	Crypto Accelerator	Crypto Accelerator
Other On-Chip Memory	2.5 MB w/ECC	2.5 MB w/ECC	2.5 MB w/ECC	2.5 MB w/ECC	2.5 MB w/ECC
PCI/PCIe	2 PCIe	2 PCIe	2 PCIe	2 PCIe Gen 2	2 PCIe Gen 2
PWM, Ch	3	3	3
PWM(Ch)				3	3
Package Group	FCBGA	FCBGA	FCBGA	FCBGA	FCBGA
QSPI	1	1	1	1	1
RTC	1	1	1	1	1
Rating	Catalog	Catalog	Catalog	Catalog	Catalog
SATA	1	1	1	1	1
SPI	4	4	4	4	4
Security Enabler				Cryptographic Acceleration Debug Security Device Identity External Memory Protection Initial Secure Programming Physical Security Secure Boot Secure Storage Software IP Protection Trusted Execution Environment	Cryptographic Acceleration Debug Security Device Identity External Memory Protection Initial Secure Programming Physical Security Secure Boot Secure Storage Software IP Protection Trusted Execution Environment
Serial I/O	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN I2C SPI UART USB	CAN I2C SPI UART USB
UART, SCI	10	10	10
UART(SCI)				10	10
USB	2	2	2	2	2
USB 2.0	1	1	1	1	1
USB 3.0	1	1	1	1	1
Video Port, Configurable	6+	6+	6+
Video Port (Configurable)				6+	6+
Video Resolution/Frame Rate	1080p60	1080p60	1080p60	1080p60	1080p60
eCAP	3	3	3	3	3
eQEP	3	3	3	3	3

Экологический статус

Application Notes

• Скачать
  AM572x Thermal Considerations
  PDF, 400 Кб, Файл опубликован: 6 дек 2016
  This application report discusses thermal performance of the Sitara AM572x series processors. Data presented demonstrates the effects of different thermal management strategies in terms of processor junction temperature and power consumption across CPU loading and ambient temperature.
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  TPS659037 Operation With Higher Capacitive Loading
  PDF, 811 Кб, Файл опубликован: 7 окт 2015
  This TPS659037 Operation With Higher Capacitive Loading application report addresses use-cases where external components demand a higher capacitive loading than the rating of the TPS659037 SMPS-outputs (57-ОјF maximum per phase). The specification of the device with a rating of nominal 47 ОјF and maximum of 57 ОјF holds true. Exceeding these values is at the risk of the user and requires thorough val
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  TPS659037 Design Guide
  PDF, 62 Кб, Файл опубликован: 21 сен 2015
  This application note provides guidance on schematic design and can be used as a design review of applications using the TPS659037 power management IC (PMIC). This document describes recommended external components recommended connections of select signals and contains a design checklist. Prior to using this guide TI recommends reading the user's guide TPS659037 User's Guide to Power AM572x an
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  TPS659037 Design Checklist (Rev. A)
  ZIP, 45 Кб, Версия: A, Файл опубликован: 13 янв 2016
• Скачать
  DSPLIB for Processor SDK RTOS
  PDF, 461 Кб, Файл опубликован: 4 ноя 2016
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  AM572x GP EVM Power Simulations
  PDF, 22.4 Мб, Файл опубликован: 8 окт 2015
  The purpose of this application report is to present the flow, the environment settings and TI requirements used to perform the analysis of critical power nets of a platform using an application processor. The Power Delivery Network (PDN) performance is measured by extracting and analyzing three printed circuit board (PCB) parameters: DC resistivity, capacitor loop inductance, and broadband target
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  EMIF Tools (Rev. A)
  PDF, 207 Кб, Версия: A, Файл опубликован: 5 июн 2017
  At the center of every application is the need for memory. With limited on-chip processor memory, external memory serves as a solution for large software systems and data storage, and an unstable external memory interface can result in system failures or hinder software development. To prevent potential system level anomalies and ensure robust systems, hardware must be configured correctly and tes
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  AM57x Processor SDK Linux: Customization of Multicore Application to Run on a Ne
  PDF, 55 Кб, Файл опубликован: 6 окт 2016
  When customers develop applications that use multiple programmable cores on the AM57x they require a clear understanding of roles and configurations of multiple software (SW) components such as IPC, CMEM, CMA, Linuxв„ў, and SYS/BIOS on slave cores, in order to arrive at correct configuration for their application. This application report describes memory utilization schemes by A15/DSP/IPU, how they
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  Keystone EDMA FAQ
  PDF, 1.3 Мб, Файл опубликован: 1 сен 2016
  This document is a collection of frequently asked questions (FAQs) on enhanced direct memory access (EDMA) on KeyStoneв„ў I (KS1) and KeyStone II (KS2) devices, along with useful collateral and software reference links.
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  AM572x/AM571x Compatibility Guide (Rev. C)
  PDF, 182 Кб, Версия: C, Файл опубликован: 22 фев 2016
  This application report provides a summary of the differences between AM572x Silicon Revision 1.1/2.0 and AM571x Silicon Revision 1.0 high-performance ARMВ® devices.
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  Code Composer Studio Device Support Package
  PDF, 87 Кб, Файл опубликован: 19 ноя 2015
  This document gives a brief description of download location and installation procedures of the device Chip Support Package (CSP) for Code Composer Studioв„ў (CCS).
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  IODELAY Application Note for AM57xx Devices (Rev. A)
  PDF, 785 Кб, Версия: A, Файл опубликован: 3 авг 2017
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  AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)
  PDF, 2.2 Мб, Версия: A, Файл опубликован: 1 май 2004
  Application Note 1281 Bumped Die (Flip Chip) Packages
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  TI DSP Benchmarking
  PDF, 62 Кб, Файл опубликован: 13 янв 2016
  This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
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  Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
  PDF, 324 Кб, Версия: A, Файл опубликован: 17 авг 2016
  This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
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  Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
  PDF, 1.6 Мб, Версия: B, Файл опубликован: 13 авг 2015
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  High-Speed Interface Layout Guidelines (Rev. G)
  PDF, 814 Кб, Версия: G, Файл опубликован: 27 июл 2017
  As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

Модельный ряд

Классификация производителя

• Semiconductors> Processors> Sitara Processors> ARM Cortex-A15> AM57x