Datasheet Texas Instruments AM5716AABCDA — Даташит
| Производитель | Texas Instruments |
| Серия | AM5716 |
| Модель | AM5716AABCDA |
Процессор Sitara: ARM Cortex-A15 и DSP 760-FCBGA от -40 до 105
Datasheets
AM571x Sitara Processors Silicon Revision 2.0 datasheet
PDF, 4.2 Мб, Версия: F, Файл опубликован: 11 сен 2017
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Цены
 Купить AM5716AABCDA на РадиоЛоцман.Цены — от 3 262 до 9 777 ₽20 предложений от 8 поставщиков Интегральные микросхемы Встроенные микросхемы - Микропроцессоры | |||
| AM5716AABCDA Texas Instruments | 3 262 ₽ | ||
| AM5716AABCDA Texas Instruments | 3 633 ₽ | ||
| AM5716AABCDA Texas Instruments | 3 861 ₽ | ||
| AM5716AABCDA Texas Instruments | по запросу | ||
Статус
| Статус продукта | В производстве (Рекомендуется для новых разработок) |
| Доступность образцов у производителя | Да |
Корпус / Упаковка / Маркировка
| Pin | 760 | 760 |
| Package Type | ABC | ABC |
| Industry STD Term | FCBGA | FCBGA |
| JEDEC Code | S-PBGA-N | S-PBGA-N |
| Package QTY | 60 | 60 |
| Carrier | EIAJ TRAY (5+1) | EIAJ TRAY (5+1) |
| Маркировка | AM5716AABCDA | SITARATM |
| Width (мм) | 23 | 23 |
| Length (мм) | 23 | 23 |
| Thickness (мм) | 2.39 | 2.39 |
| Pitch (мм) | .8 | .8 |
| Max Height (мм) | 2.96 | 2.96 |
| Mechanical Data | Скачать | Скачать |
Параметры
| ARM CPU | 1 ARM Cortex-A15 |
| ARM MHz | 500,1500 Max. |
| ARM MIPS | 1750,5250 Max. |
| Application | Communications Equipment,Enterprise Systems,Industrial,Personal Electronics |
| CAN | 2 |
| CSI-2 | 2 |
| Co-Processor | 2 ARM Cortex-M4,4 PRU-ICSS s |
| DMA | 64-Ch EDMA Ch |
| DRAM | DDR3,DDR3L |
| DSP | 1 C66x |
| DSP MHz | 500,750 Max. |
| EMAC | 10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC |
| General Purpose Memory | 1 16-bit (GPMC, NAND flash,NOR Flash,SRAM) |
| I2C | 5 |
| IO Supply | 1.8,3.3 В |
| Industrial Protocols | 1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III |
| MMC/SD | 4 |
| McASP | 8 |
| On-Chip L1 Cache | 32KB (L1D and L1I ARM Cortex-A15) |
| On-Chip L2 Cache | 1 MB w/ECC (ARM Cortex-A15),288 KB (C66x) |
| Operating Systems | Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE |
| Рабочий диапазон температур | от -40 до 105,-40 до 125,0 до 90 C |
| Other Hardware Acceleration | Crypto Accelerator |
| Other On-Chip Memory | 512 KB w/ECC |
| PCI/PCIe | 2 PCIe |
| PWM | 3 Ch |
| Package Group | FCBGA |
| QSPI | 1 |
| RTC | 1 |
| Rating | Catalog |
| SATA | 1 |
| SPI | 4 |
| Serial I/O | CAN,I2C,SPI,UART,USB |
| UART | 10 SCI |
| USB | 2 |
| USB 2.0 | 1 |
| USB 3.0 | 1 |
| Video Port | 6+ Configurable |
| eCAP | 3 |
| eQEP | 3 |
Экологический статус
| RoHS | Совместим |
Комплекты разработчика и оценочные наборы
- Development Kits: TMDXIDK57X-LCD
AM57x IDK LCD Kit
Статус продукта: В производстве (Рекомендуется для новых разработок) - Evaluation Modules & Boards: TMDSCM572X
TMDSEVM572x Camera Module
Статус продукта: В производстве (Рекомендуется для новых разработок) - Evaluation Modules & Boards: TMDSEVM572X
AM572x Evaluation Module
Статус продукта: В производстве (Рекомендуется для новых разработок)
Application Notes
- AM571x Power Estimation ToolPDF, 28 Кб, Файл опубликован: 19 июл 2017
The power estimation spreadsheet provides power consumption estimates based on measured and simulated data; they are provided “as is” and are not guaranteed within a specified precision. Power consumption depends on electrical parameters, silicon process variations, environmental conditions, and use cases running on the processor during operation. Actual power consumption should be verified in the - AM571x Power Consumption SummaryPDF, 70 Кб, Файл опубликован: 27 мар 2017
This application report discusses the power consumption for common system application usage scenarios for the AM571x Sitaraв„ў processors. The metrics contained in this document serve to provide users with a better understanding of AM571x active power behaviors: making it easier to determine a suitable configuration to meet a given power budget. - AM572x GP EVM Power SimulationsPDF, 22.4 Мб, Файл опубликован: 8 окт 2015
The purpose of this application report is to present the flow, the environment settings and TI requirements used to perform the analysis of critical power nets of a platform using an application processor. The Power Delivery Network (PDN) performance is measured by extracting and analyzing three printed circuit board (PCB) parameters: DC resistivity, capacitor loop inductance, and broadband target - AM57xx BGA PCB DesignPDF, 69 Кб, Файл опубликован: 25 авг 2017
This application report is designed to help customers understand what is involved with PCB design for AM57xx BGAs. - Sitara Processor Power Distribution Networks: Implementation and AnalysisPDF, 6.7 Мб, Файл опубликован: 4 апр 2017
The purpose of a power distribution network (PDN) is primarily to provide clean and reliable power to the active devices on the system. The printed circuit board (PCB) is a critical component of the system-level PDN delivery network. As such, optimal design of the PCB power distribution network is of utmost importance for high performance microprocessors. This application report provides implement - Code Composer Studio Device Support PackagePDF, 87 Кб, Файл опубликован: 19 ноя 2015
This document gives a brief description of download location and installation procedures of the device Chip Support Package (CSP) for Code Composer Studioв„ў (CCS). - IODELAY Application Note for AM57xx Devices (Rev. A)PDF, 785 Кб, Версия: A, Файл опубликован: 3 авг 2017
- AM57x Processor SDK Linux: Customization of Multicore Application to Run on a NePDF, 55 Кб, Файл опубликован: 6 окт 2016
When customers develop applications that use multiple programmable cores on the AM57x they require a clear understanding of roles and configurations of multiple software (SW) components such as IPC, CMEM, CMA, Linuxв„ў, and SYS/BIOS on slave cores, in order to arrive at correct configuration for their application. This application report describes memory utilization schemes by A15/DSP/IPU, how they - AM572x/AM571x Compatibility Guide (Rev. C)PDF, 182 Кб, Версия: C, Файл опубликован: 22 фев 2016
This application report provides a summary of the differences between AM572x Silicon Revision 1.1/2.0 and AM571x Silicon Revision 1.0 high-performance ARMВ® devices. - AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)PDF, 2.2 Мб, Версия: A, Файл опубликован: 1 май 2004
Application Note 1281 Bumped Die (Flip Chip) Packages - PRU-ICSS Migration Guide: AM335x to AM57x (Rev. A)PDF, 71 Кб, Версия: A, Файл опубликован: 13 июл 2017
This software migration guide assists in porting legacy software developed for the Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-CSS) on AM335x to AM57x platforms. - EMIF Tools (Rev. A)PDF, 207 Кб, Версия: A, Файл опубликован: 5 июн 2017
At the center of every application is the need for memory. With limited on-chip processor memory, external memory serves as a solution for large software systems and data storage, and an unstable external memory interface can result in system failures or hinder software development. To prevent potential system level anomalies and ensure robust systems, hardware must be configured correctly and tes - Processor SDK RTOS Audio Benchmark Starter KitPDF, 530 Кб, Файл опубликован: 12 апр 2017
The TI TMS320C6000в„ў Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications that are commonly used in audio processing application. This application notes describes Audio Benchmark Starterkit software that is intended to provide an easy and quick way to benchmark key audio functions on C66x and C674x DSP device - Processor-SDK RTOS Power Management and MeasurementPDF, 78 Кб, Файл опубликован: 2 авг 2017
Processor-SDK RTOS provides out-of-the-box power management examples that empower customers to tailor Sitara processors’ (ARM and DSP) power-performance points per use case. You can configure all supported operating points and run CPU Idle and Dhrystone benchmarking workloads while employing a minimal kernel with real-time assurance. This application report provides an overview of the Processor-SD - PRU-ICSS Feature ComparisonPDF, 29 Кб, Файл опубликован: 5 июн 2017
This application report documents the feature differences between the PRU subsystems available on different TI processors. - TI DSP BenchmarkingPDF, 62 Кб, Файл опубликован: 13 янв 2016
This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms. - Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Мб, Версия: B, Файл опубликован: 13 авг 2015
- High-Speed Interface Layout Guidelines (Rev. G)PDF, 814 Кб, Версия: G, Файл опубликован: 27 июл 2017
As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.
Модельный ряд
Серия: AM5716 (8)
Классификация производителя
- Semiconductors > Processors > Sitara Processors > ARM Cortex-A15 > AM57x
