Datasheet Texas Instruments AM3703CUSD100 — Даташит
| Производитель | Texas Instruments |
| Серия | AM3703 |
| Модель | AM3703CUSD100 |
Процессор Sitara: ARM Cortex-A8, LPDDR 423-FCBGA от -40 до 90
Datasheets
AM3715, AM3703 Sitara ARM Microprocessors datasheet
PDF, 3.2 Мб, Версия: F, Файл опубликован: 29 авг 2011
Выписка из документа
Цены
 Купить AM3703CUSD100 на РадиоЛоцман.Цены — от 14 до 12 600 ₽16 предложений от 11 поставщиков MPU AM37x RISC 32Bit 45nm 1GHz 423Pin FC/CSP | |||
| AM3703CUSD100 Rochester Electronics | от 14 ₽ | ||
| AM3703CUSD100 Texas Instruments | 1 864 ₽ | ||
| AM3703CUSD100 Texas Instruments | 2 605 ₽ | ||
| AM3703CUSD100 Texas Instruments | 2 761 ₽ | ||
Статус
| Статус продукта | В производстве (Рекомендуется для новых разработок) |
| Доступность образцов у производителя | Да |
Корпус / Упаковка / Маркировка
| Pin | 423 |
| Package Type | CUS |
| Industry STD Term | FC/CSP |
| JEDEC Code | S-PBGA-N |
| Package QTY | 90 |
| Carrier | JEDEC TRAY (5+1) |
| Маркировка | AM3703CUSD100 |
| Width (мм) | 16 |
| Length (мм) | 16 |
| Thickness (мм) | .96 |
| Pitch (мм) | .65 |
| Max Height (мм) | 1.4 |
| Mechanical Data | Скачать |
Параметры
| ARM CPU | 1 ARM Cortex-A8 |
| ARM MHz | 1000 Max. |
| Applications | Industrial,Personal Electronics |
| DRAM | LPDDR |
| Display Options | DSS |
| Graphics Acceleration | N/A |
| I2C | 4 |
| On-Chip L2 Cache | 256 KB (ARM Cortex-A8) |
| Operating Systems | Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE |
| Рабочий диапазон температур | от -40 до 105,-40 до 90,0 до 90 C |
| Other On-Chip Memory | 64 KB |
| Rating | Catalog |
| SPI | 4 |
| UART | 4 SCI |
| USB | 4 |
| Video Port | 1 Input,1 Output Configurable |
Экологический статус
| RoHS | Совместим |
Комплекты разработчика и оценочные наборы
- JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
XDS560v2 System Trace USB & Ethernet Debug Probe
Статус продукта: В производстве (Рекомендуется для новых разработок) - Evaluation Modules & Boards: TMDSEVM3730
AM/DM37x Evaluation Module
Статус продукта: В производстве (Рекомендуется для новых разработок) - JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
XDS560v2 System Trace USB Debug Probe
Статус продукта: В производстве (Рекомендуется для новых разработок) - JTAG Emulators/ Analyzers: TMDSEMU200-U
XDS200 USB Debug Probe
Статус продукта: В производстве (Рекомендуется для новых разработок) - Evaluation Modules & Boards: BEAGLEXM
BeagleBoard-xM Development Board
Статус продукта: Снят с производства (Производитель прекратил производство прибора)
Application Notes
- AM3715/03 SDRC SubsystemPDF, 19 Кб, Файл опубликован: 3 июн 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM3715/03_SDRC_SubsystemThe SDRC subsystem module provides connectivity between the AM37x and SDRAM memory components. The module incl - AM/DM37x Power Estimation SpreadsheetPDF, 20 Кб, Файл опубликован: 7 июн 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or tocontribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Power_Estimation_SpreadsheetThis article discusses the power consumption of the Texas Instruments AM/DM37x high - AM/DM37x OverviewPDF, 19 Кб, Файл опубликован: 3 июн 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Overview.This document provides an overview of the AM37x applications processor.All trademarks are property of their respective - AM3715/03 Memory SubsystemPDF, 19 Кб, Файл опубликован: 3 июн 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM3715/03_Memory_SubsystemThe Memory Subsystem in the AM3715/03 devices consists of the internal SRAM and two dedicated memory contr - AM37x/DM37x Schematic ChecklistPDF, 19 Кб, Файл опубликован: 3 июн 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x/DM37x_Schematic_Checklist.This article provides many tips related to reset, JTAG, peripherals, etc. It should be used as - AM37x EVM Software Developer's GuidePDF, 19 Кб, Файл опубликован: 3 июн 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_EVM_Software_Developer%27s_Guide.This wiki article illustrates the various software components provided with the A - PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUsPDF, 739 Кб, Файл опубликован: 15 июн 2011
The purpose of a power distribution network (PDN) is to provide clean and reliable power to active devices in the system. The printed circuit board (PCB) is a critical component of the system-level PDN. Therefore, the PCB design is of utmost importance for high-performance low-power microprocessors. This application report provides design requirements and details a step-by-step methodology on how - Ethernet Connectivity via GPMCPDF, 19 Кб, Файл опубликован: 3 июн 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Ethernet_Connectivity_via_GPMCThe purpose of this article is to describe a solution for connecting Ethernet to various devices, - Setting up AM37x SDRC RegistersPDF, 19 Кб, Файл опубликован: 3 июн 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Setting_up_AM37x_SDRC_registersThis wiki article describes how to set the SDRC registers in the OMAP35x SDRC module depending o - AM37x CUS Routing GuidelinesPDF, 19 Кб, Файл опубликован: 3 июн 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_CUS_Routing_Guidelines.CUS package is designed with a new technology called Via Channelв„ў array. This technology allows for e - OMAP35x to AM37x Hardware Migration GuidePDF, 37 Кб, Файл опубликован: 3 июн 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:http://processors.wiki.ti.com/index.php/OMAP35x_To_AM37x_Hardware_Migration_Guide.
The OMAP35x to AM37x Hardware Migration Guide describes device consideratio
- PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages Part II (Rev. A)PDF, 2.4 Мб, Версия: A, Файл опубликован: 1 ноя 2013
Once the bottom circuit board has been designed the assembly guidelines for package-on-package (PoP) versions of the OMAP35xx processor and the memory device must be considered.PoP packages have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of final assembly: the circuit board design the solder paste char
- PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages Part I (Rev. B)PDF, 6.7 Мб, Версия: B, Файл опубликован: 13 июн 2009
Ball grid array (BGA) packages having 0.4mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies; the standard rules of thumb don't apply anymore. In fact the design guidelines for 0.4mm and 0.5mm differ primarily due to issues surrounding shorts or opens between balls under the processor.In addition to the de - PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors Part IPDF, 2.0 Мб, Файл опубликован: 23 июн 2010
Ball grid array (BGA) packages having 0.5mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies. PCBs with package-on-package (PoP) technology have additional assembly requirements and options that need to be considered when designing the PCB.Fine-pitch PCB design is a team effort and may require more than
- PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors Part IIPDF, 1.2 Мб, Файл опубликован: 23 июн 2010
Once the main printed circuit board (PCB) has been designed the assembly guidelines for the 0.5mm package-on-package (PoP) applications processor and companion memory device must be considered. PoP applications processors have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of PCB assembly: PoP applications process
Модельный ряд
Серия: AM3703 (13)
Классификация производителя
- Semiconductors > Processors > Sitara Processors > ARM Cortex-A8 > AM3x
