Datasheet Texas Instruments 74AC11273 — Даташит
| Производитель | Texas Instruments |
| Серия | 74AC11273 |
Восьмеричные шлепанцы типа D с прозрачным
Datasheets
Цены
Octal D-Type Flip-Flops With Clear 24-PDIP -40 to 85 | |||
| 74AC11273NT Texas Instruments | по запросу | ||
| 74AC11273DW Fairchild | по запросу | ||
| 74AC11273D Fairchild | по запросу | ||
Статус
| 74AC11273DW | 74AC11273NT | |
|---|---|---|
| Статус продукта | Снят с производства | Снят с производства |
| Доступность образцов у производителя | Нет | Нет |
Корпус / Упаковка / Маркировка
| 74AC11273DW | 74AC11273NT | |
|---|---|---|
| N | 1 | 2 |
| Pin | 24 | 24 |
| Package Type | DW | NT |
| Industry STD Term | SOIC | PDIP |
| JEDEC Code | R-PDSO-G | R-PDIP-T |
| Width (мм) | 7.5 | 6.73 |
| Length (мм) | 15.4 | 31.64 |
| Thickness (мм) | 2.35 | 4.57 |
| Pitch (мм) | 1.27 | 2.54 |
| Max Height (мм) | 2.65 | 5.08 |
| Mechanical Data | Скачать | Скачать |
Экологический статус
| 74AC11273DW | 74AC11273NT | |
|---|---|---|
| RoHS | Не совместим | Не совместим |
| Бессвинцовая технология (Pb Free) | Нет | Нет |
Application Notes
- Live InsertionPDF, 150 Кб, Файл опубликован: 1 окт 1996
Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha - Implications of Slow or Floating CMOS Inputs (Rev. D)PDF, 260 Кб, Версия: D, Файл опубликован: 23 июн 2016
- Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)PDF, 614 Кб, Версия: C, Файл опубликован: 2 дек 2015
- Semiconductor Packing Material Electrostatic Discharge (ESD) ProtectionPDF, 337 Кб, Файл опубликован: 8 июл 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge - TI IBIS File Creation Validation and Distribution ProcessesPDF, 380 Кб, Файл опубликован: 29 авг 2002
The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con - CMOS Power Consumption and CPD Calculation (Rev. B)PDF, 89 Кб, Версия: B, Файл опубликован: 1 июн 1997
Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale - Input and Output Characteristics of Digital Integrated CircuitsPDF, 1.7 Мб, Файл опубликован: 1 окт 1996
This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou - Designing With Logic (Rev. C)PDF, 186 Кб, Версия: C, Файл опубликован: 1 июн 1997
Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w - Using High Speed CMOS and Advanced CMOS in Systems With Multiple VccPDF, 43 Кб, Файл опубликован: 1 апр 1996
Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren
Модельный ряд
Серия: 74AC11273 (2)
Классификация производителя
- Semiconductors> Logic> Flip-Flop/Latch/Register> D-Type Flip-Flop
