Datasheet Texas Instruments SN74LVC1G00DBVTG4 — Даташит
| Производитель | Texas Instruments |
| Серия | SN74LVC1G00 |
| Модель | SN74LVC1G00DBVTG4 |
Одиночный 2 входа, положительный логический элемент NAND 5-SOT-23 от -40 до 125
Datasheets
SN74LVC1G00 Single 2-Input Positive-NAND Gate datasheet
PDF, 1.5 Мб, Версия: AB, Файл опубликован: 23 апр 2014
Выписка из документа
Цены
 Купить SN74LVC1G00DBVTG4 на РадиоЛоцман.Цены — от 22 до 96 ₽23 предложений от 13 поставщиков Интегральные микросхемы Логические микросхемы - Затворы и Инверторы | |||
| SN74LVC1G00DBVTG4 Texas Instruments | 22 ₽ | ||
| SN74LVC1G00DBVTG4 Texas Instruments | 26 ₽ | ||
| SN74LVC1G00DBVTG4 Texas Instruments | 96 ₽ | ||
| SN74LVC1G00DBVTG4 Texas Instruments | по запросу | ||
Статус
| Статус продукта | В производстве (Рекомендуется для новых разработок) |
| Доступность образцов у производителя | Нет |
Корпус / Упаковка / Маркировка
| Pin | 5 |
| Package Type | DBV |
| Industry STD Term | SOT-23 |
| JEDEC Code | R-PDSO-G |
| Package QTY | 250 |
| Carrier | SMALL T&R |
| Маркировка | C00F |
| Width (мм) | 1.6 |
| Length (мм) | 2.9 |
| Thickness (мм) | 1.2 |
| Pitch (мм) | .95 |
| Max Height (мм) | 1.45 |
| Mechanical Data | Скачать |
Параметры
| 3-State Output | No |
| Bits | 1 |
| F @ Nom Voltage(Max) | 150 Mhz |
| Gate Type | NAND |
| ICC @ Nom Voltage(Max) | 0.01 мА |
| Logic | True |
| Рабочий диапазон температур | от -40 до 125,-40 до 85 C |
| Output Drive (IOL/IOH)(Max) | 32/-32 мА |
| Package Group | SOT-23 |
| Package Size: mm2:W x L | 5SOT-23: 8 mm2: 2.8 x 2.9(SOT-23) PKG |
| Rating | Catalog |
| Schmitt Trigger | No |
| Special Features | Ioff,down translation to Vcc,Small DPW package,low power |
| Sub-Family | NAND Gate |
| Technology Family | LVC |
| VCC(Max) | 5.5 В |
| VCC(Min) | 1.65 В |
| Voltage(Nom) | 1.8,2.5,3.3,5 В |
| tpd @ Nom Voltage(Max) | 9,5.5,4.7,4 нс |
Экологический статус
| RoHS | Совместим |
Application Notes
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The NanoStarв„ў Wafer Chip-Scale Package (WCSP) is a family of bare die packages developed for applications that require the smallest possible package. WCSP provides electrical interconnection via solder spheres attached to the die and is aligned with JEDEC package standard MOв€’211. NanoStarв„ў, with advanced materials engineering technology, has demonstrated excellent board level rel - Designing and Manufacturing with TI's X2SON PackagesPDF, 134 Кб, Файл опубликован: 23 авг 2017
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Модельный ряд
Серия: SN74LVC1G00 (20)
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Классификация производителя
- Semiconductors > Logic > Little Logic
