Datasheet Texas Instruments LM5576QMH/NOPB — Даташит
| Производитель | Texas Instruments |
| Серия | LM5576-Q1 |
| Модель | LM5576QMH/NOPB |
Понижающий импульсный стабилизатор 75 В, 3 А 20-HTSSOP от -40 до 125
Datasheets
LM5576/-Q1 SIMPLE SWITCHERВ® 6V to 75V, 3A Wide Vin Step-Down Regulator datasheet
PDF, 966 Кб, Версия: B, Файл опубликован: 4 май 2013
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Статус
| Статус продукта | В производстве (Рекомендуется для новых разработок) |
| Доступность образцов у производителя | Да |
Корпус / Упаковка / Маркировка
| Pin | 20 | 20 |
| Package Type | PWP | PWP |
| Industry STD Term | HTSSOP | HTSSOP |
| JEDEC Code | R-PDSO-G | R-PDSO-G |
| Package QTY | 73 | 73 |
| Carrier | TUBE | TUBE |
| Маркировка | QMH | LM5576 |
| Width (мм) | 4.4 | 4.4 |
| Length (мм) | 6.5 | 6.5 |
| Thickness (мм) | 1 | 1 |
| Pitch (мм) | .65 | .65 |
| Max Height (мм) | 1.2 | 1.2 |
| Mechanical Data | Скачать | Скачать |
Параметры
| Control Mode | Current Mode |
| Duty Cycle(Max) | 95 % |
| Iout(Max) | 3 A |
| Iq(Typ) | 1 мА |
| Рабочий диапазон температур | от -40 до 125 C |
| Package Group | HTSSOP |
| Rating | Automotive |
| Regulated Outputs | 1 |
| Special Features | Enable |
| Switching Frequency(Max) | 500 kHz |
| Switching Frequency(Min) | 50 kHz |
| Тип | Converter |
| Vin(Max) | 75 В |
| Vin(Min) | 6 В |
| Vout(Max) | 70 В |
| Vout(Min) | 1.23 В |
Экологический статус
| RoHS | Совместим |
Комплекты разработчика и оценочные наборы
- Evaluation Modules & Boards: LM5576EVAL
75V, 3A Step-Down Switching Regulator Evaluation Module
Статус продукта: В производстве (Рекомендуется для новых разработок)
Application Notes
- Quick Start Guide for a 3 Amp Buck Regulator Using the LM5576 and LM25576 (Rev. B)PDF, 63 Кб, Версия: B, Файл опубликован: 23 апр 2013
This application note provides an easy to use process to design a 3 Amp buck regulator using the LM5576and LM25576 switching regulators. - Understanding and Applying Current-Mode Control TheoryPDF, 409 Кб, Файл опубликован: 19 авг 2007
- AN-643 EMI/RFI Board Design (Rev. B)PDF, 742 Кб, Версия: B, Файл опубликован: 3 май 2004
Application Note 643 EMI/RFI Board Design - Input and Output Capacitor SelectionPDF, 219 Кб, Файл опубликован: 19 сен 2005
- AN-1197 Selecting Inductors for Buck Converters (Rev. B)PDF, 558 Кб, Версия: B, Файл опубликован: 23 апр 2013
This application report provides design information to help select an off-the-shelf inductor for anycontinuous-mode buck converter application. - AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)PDF, 3.6 Мб, Версия: A, Файл опубликован: 23 апр 2013
This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor. - AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)PDF, 1.4 Мб, Версия: A, Файл опубликован: 23 апр 2013
This application note provides thermal power analysis techniques for analyzing the power IC. - AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)PDF, 2.7 Мб, Версия: A, Файл опубликован: 23 апр 2013
This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time. - Semiconductor and IC Package Thermal Metrics (Rev. C)PDF, 201 Кб, Версия: C, Файл опубликован: 19 апр 2016
- AN-1997 Error Amplifier Limitations in High-Performance Regulator Applications (Rev. A)PDF, 153 Кб, Версия: A, Файл опубликован: 6 май 2013
The development of realistic predictions to assist the power supply engineer during the control loop design process is facilitated in this application report by appropriate small-signal and bode plot analysis, the validity of which is verified through simulation results. - Low EMI Layout Made SIMPLE With LM43600/1/2/3 and LM46000/1/2 (Rev. A)PDF, 512 Кб, Версия: A, Файл опубликован: 12 сен 2014
Printed Circuit Board (PCB) layout for Switched Mode Power Supplies (SMPS) is critical to achieve proper converter operation good thermal performance and excellent radiated EMI performance. Optimized board layout for low radiated EMI is made very simple by the package and pin arrangement of the SIMPLE SWITCHER Synchronous Buck Converter family LM4360x and LM4600x - AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)PDF, 82 Кб, Версия: C, Файл опубликован: 23 апр 2013
When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current - AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)PDF, 374 Кб, Версия: C, Файл опубликован: 23 апр 2013
This application report provides SIMPLE SWITCHER™ PCB layout guidelines. - AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)PDF, 2.5 Мб, Версия: C, Файл опубликован: 24 апр 2013
Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti - AN-1246 Stresses in Wide Input DC-DC Converters (Rev. C)PDF, 427 Кб, Версия: C, Файл опубликован: 23 апр 2013
This application note discusses stresses in wide input DC-DC converters. - AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)PDF, 9.2 Мб, Версия: B, Файл опубликован: 23 апр 2013
This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
Модельный ряд
Серия: LM5576-Q1 (4)
- LM5576Q0MH/NOPB LM5576Q0MHX/NOPB LM5576QMH/NOPB LM5576QMHX/NOPB
Классификация производителя
- Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Down (Buck) > Buck Converter (Integrated Switch)
