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Datasheet Texas Instruments SN74ABTH245DGVR — Даташит

ПроизводительTexas Instruments
СерияSN74ABTH245
МодельSN74ABTH245DGVR
Datasheet Texas Instruments SN74ABTH245DGVR

Восьмеричные шинные трансиверы с выходами с 3 состояниями 20-TVSOP от -40 до 85

Datasheets

Octal Bus Transceivers With 3-State Outputs datasheet
PDF, 1.0 Мб, Версия: D, Файл опубликован: 14 сен 1999
Выписка из документа

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SN74ABTH245DGVR
Texas Instruments
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Texas Instruments
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SN74ABTH245DGVRE4
Texas Instruments
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LED-драйверы MOSO для индустриальных приложений

Статус

Статус продуктаСнят с производства (Производитель прекратил производство прибора)
Доступность образцов у производителяНет

Корпус / Упаковка / Маркировка

Pin20
Package TypeDGV
Industry STD TermTVSOP
JEDEC CodeR-PDSO-G
Width (мм)4.4
Length (мм)5
Thickness (мм)1.05
Pitch (мм).4
Max Height (мм)1.2
Mechanical DataСкачать

Параметры

Approx. Price (US$)0.25 | 1ku
Bits(#)8
F @ Nom Voltage(Max)(Mhz)150
ICC @ Nom Voltage(Max)(mA)0.25
Тип входаTTL
Operating Temperature Range(C)-40 to 85
Output Drive (IOL/IOH)(Max)(mA)-32/64
Тип выходаTTL
Package GroupTVSOP
Package Size: mm2:W x L (PKG)See datasheet (PDIP)
RatingCatalog
Schmitt TriggerNo
Technology FamilyABT
VCC(Max)(V)5.5
VCC(Min)(V)4.5
Voltage(Nom)(V)5
tpd @ Nom Voltage(Max)(ns)3.9

Экологический статус

RoHSНе совместим
Бессвинцовая технология (Pb Free)Нет

Application Notes

  • Bus-Hold Circuit
    PDF, 418 Кб, Файл опубликован: 5 фев 2001
    When designing systems that include CMOS devices, designers must pay special attention to the operating condition in which all of the bus drivers are in an inactive, high-impedance condition (3-state). Unless special measures are taken, this condition can lead to undefined levels and, thus, to a significant increase in the device?s power dissipation. In extreme cases, this leads to oscillation of
  • Quad Flatpack No-Lead Logic Packages (Rev. D)
    PDF, 1.0 Мб, Версия: D, Файл опубликован: 16 фев 2004
    Texas Instruments (TI) Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241 allow for board miniaturization and hold several advantages over traditional SOIC SSOP TSSOP and TVSOP packages. The packages are physically smaller have a smaller routing area improved thermal performance and improved electrical parasitics while
  • Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B)
    PDF, 528 Кб, Версия: B, Файл опубликован: 1 июн 1997
    The purpose of this document is to assist the designers of high-performance digital logic systems in using the advanced BiCMOS technology (ABT) logic family. Detailed electrical characteristics of these bus-interface devices are provided and tables and graphs have been included to compare specific parameters of the ABT family with those of other logic families. In addition typical data is provide
  • Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A)
    PDF, 115 Кб, Версия: A, Файл опубликован: 1 мар 1997
    Advanced bus-interface logic (ABIL) products processed in submicron advanced BiCMOS technologies (ABT) address the specific end-equipment demands of workstations personal and portable computers and telecommunications markets. This document discusses ABIL as system bus interfaces the merits of ABT its I/O structure packaging and ABT products for end-equipment specific solutions.
  • Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A)
    PDF, 80 Кб, Версия: A, Файл опубликован: 1 дек 1996
    This document shows the output skew for the ABT16254 ABT16952 and ABT16500A devices of the TI advanced BiCMOS (ABT) family. The data samples show which output skew is being examined where the data originates and how it is analyzed. Some errors present in the data are discussed. Skew curves at varying temperatures are given for the ABT16240 ABT16245 ABT16952 ABT16500A and ABT16249 devic
  • Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
    PDF, 209 Кб, Файл опубликован: 10 май 2002
    Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features

Модельный ряд

Классификация производителя

  • Semiconductors > Logic > Buffer/Driver/Transceiver > Standard Transceiver

На английском языке: Datasheet Texas Instruments SN74ABTH245DGVR

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