Datasheet Texas Instruments LMR61428XMM/NOPB — Даташит
| Производитель | Texas Instruments |
| Серия | LMR61428 |
| Модель | LMR61428XMM/NOPB |
Повышающий стабилизатор напряжения 8-VSSOP от 1,2 до 14 В, 2,85 А, 2 МГц, от -40 до 85
Datasheets
LMR61428 Low Input Voltage, Step-Up DC-DC Converter datasheet
PDF, 1.0 Мб, Версия: A, Файл опубликован: 4 апр 2013
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Цены
 Купить LMR61428XMM/NOPB на РадиоЛоцман.Цены — от 59 до 316 ₽27 предложений от 14 поставщиков Интегральные микросхемы Силовые чипы — регуляторы напряжения — постоянного тока коммутирующие | |||
| LMR61428XMM/NOPB Texas Instruments | 59 ₽ | ||
| LMR61428XMM/NOPB Texas Instruments | 80 ₽ | ||
| LMR61428XMM/NOPB Texas Instruments | от 288 ₽ | ||
| LMR61428XMM/NOPB Texas Instruments | от 316 ₽ | ||
Статус
| Статус продукта | В производстве (Рекомендуется для новых разработок) |
| Доступность образцов у производителя | Да |
Корпус / Упаковка / Маркировка
| Pin | 8 |
| Package Type | DGK |
| Industry STD Term | VSSOP |
| JEDEC Code | R-PDSO-G |
| Package QTY | 1000 |
| Carrier | SMALL T&R |
| Маркировка | SN1B |
| Width (мм) | 3 |
| Length (мм) | 3 |
| Thickness (мм) | .97 |
| Pitch (мм) | .65 |
| Max Height (мм) | 1.07 |
| Mechanical Data | Скачать |
Параметры
| Duty Cycle(Max) | 70 % |
| Iq(Typ) | 0.1 мА |
| Рабочий диапазон температур | от -40 до 85 C |
| Package Group | VSSOP |
| Rating | Catalog |
| Regulated Outputs | 1 |
| Special Features | Enable |
| Switch Current Limit(Min) | 2.85 A |
| Switch Current Limit(Typ) | 2.85 A |
| Switching Frequency(Max) | 2000 kHz |
| Switching Frequency(Min) | 300 kHz |
| Тип | Converter |
| Vin(Max) | 14 В |
| Vin(Min) | 1.2 В |
| Vout(Max) | 14 В |
| Vout(Min) | 1.24 В |
Экологический статус
| RoHS | Совместим |
Комплекты разработчика и оценочные наборы
- Evaluation Modules & Boards: LMR61428XMMEVM
LMR61428 Evaluation Module
Статус продукта: В производстве (Рекомендуется для новых разработок)
Application Notes
- AN-643 EMI/RFI Board Design (Rev. B)PDF, 742 Кб, Версия: B, Файл опубликован: 3 май 2004
Application Note 643 EMI/RFI Board Design - Working With Boost ConvertersPDF, 159 Кб, Файл опубликован: 15 июн 2015
This brief note highlights some of the more common pitfalls when using boost regulators. These includemaximum achievable output current and voltage, short circuit behavior and basic layout issues. It isassumed that the reader is familiar with the basic operation of a boost regulator. - Input and Output Capacitor SelectionPDF, 219 Кб, Файл опубликован: 19 сен 2005
- Basic Calculation of a Boost Converter's Power Stage (Rev. C)PDF, 186 Кб, Версия: C, Файл опубликован: 8 янв 2014
This application note gives the equations to calculate the power stage of a boost converter built with an IC with integrated switch and operating in continuous conduction mode. It is not intended to give details on the functionality of a boost converter (see Reference 1) or how to compensate a converter. See the references at the end of this document if more detail is needed. - AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)PDF, 3.6 Мб, Версия: A, Файл опубликован: 23 апр 2013
This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor. - AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)PDF, 1.4 Мб, Версия: A, Файл опубликован: 23 апр 2013
This application note provides thermal power analysis techniques for analyzing the power IC. - AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)PDF, 2.7 Мб, Версия: A, Файл опубликован: 23 апр 2013
This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time. - Semiconductor and IC Package Thermal Metrics (Rev. C)PDF, 201 Кб, Версия: C, Файл опубликован: 19 апр 2016
- AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)PDF, 82 Кб, Версия: C, Файл опубликован: 23 апр 2013
When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current - Understanding Boost Power Stages In Switchmode Power SuppliesPDF, 149 Кб, Файл опубликован: 4 мар 1999
A switching power supply consists of the power stage and the control circuit. The power stage performs the basic power conversion from the input voltage to the output voltage and includes switches and the output filter. This report addresses the boost power stage only and does not cover control circuits. The report includes detailed steady-stage and small-signal analysis of the boost power stage o - AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)PDF, 374 Кб, Версия: C, Файл опубликован: 23 апр 2013
This application report provides SIMPLE SWITCHER™ PCB layout guidelines. - AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)PDF, 2.5 Мб, Версия: C, Файл опубликован: 24 апр 2013
Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti - AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)PDF, 9.2 Мб, Версия: B, Файл опубликован: 23 апр 2013
This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
Модельный ряд
Серия: LMR61428 (2)
- LMR61428XMM/NOPB LMR61428XMMX/NOPB
Классификация производителя
- Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Up (Boost) > Boost Converter (Integrated Switch)
