Datasheet Texas Instruments 5962-8873001DA — Даташит
Производитель | Texas Instruments |
Серия | SN54AS1032A |
Модель | 5962-8873001DA |
Четверные буферы/драйверы с 2 входами с положительным ИЛИ 14-CFP от -55 до 125
Datasheets
Datasheet
Цены
Quadruple 2-Input Positive-O Buffers/Drivers 14-CFP -55 to 125 | |||
5962-8873001DA Texas Instruments | по запросу |
Статус
Статус продукта | Снят с производства (Производитель прекратил производство прибора) |
Доступность образцов у производителя | Нет |
Корпус / Упаковка / Маркировка
Pin | 14 |
Package Type | W |
Industry STD Term | CFP |
JEDEC Code | R-GDFP-F |
Width (мм) | 5.97 |
Length (мм) | 9.21 |
Thickness (мм) | 1.59 |
Pitch (мм) | 1.27 |
Max Height (мм) | 2.03 |
Mechanical Data | Скачать |
Экологический статус
RoHS | Не совместим |
Бессвинцовая технология (Pb Free) | Нет |
Application Notes
- Input and Output Characteristics of Digital Integrated CircuitsPDF, 1.7 Мб, Файл опубликован: 1 окт 1996
This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou - Advanced Schottky (ALS and AS) Logic FamiliesPDF, 1.9 Мб, Файл опубликован: 1 авг 1995
This document introduces the advanced Schottky family of clamped TTL integrated circuits (ICs). Detailed electrical characteristics of the 'AS and 'ALS devices with table formats are provided. Guidelines for designing high-performance digital systems using the Advanced Schottky family are given along with a brief summary of the solutions to most design decisions needed to implement systems using t - TI IBIS File Creation Validation and Distribution ProcessesPDF, 380 Кб, Файл опубликован: 29 авг 2002
The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con - Advanced Schottky Load ManagementPDF, 277 Кб, Файл опубликован: 1 фев 1997
Designers of high-speed systems that include advanced Schottky (AS) devices must consider the operating environment in their work. They must be aware of the individual device characteristics and their interaction with other devices. This document provides a detailed discussion of the waveform characteristics equivalent circuit models transmission line fanout and termination for AS load manageme - Live InsertionPDF, 150 Кб, Файл опубликован: 1 окт 1996
Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha - Shelf-Life Evaluation of Lead-Free Component FinishesPDF, 1.3 Мб, Файл опубликован: 24 май 2004
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a - Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)PDF, 614 Кб, Версия: C, Файл опубликован: 2 дек 2015
- Semiconductor Packing Material Electrostatic Discharge (ESD) ProtectionPDF, 337 Кб, Файл опубликован: 8 июл 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge - Designing With Logic (Rev. C)PDF, 186 Кб, Версия: C, Файл опубликован: 1 июн 1997
Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
Модельный ряд
Серия: SN54AS1032A (5)
- 5962-88730012A 5962-8873001DA SN54AS1032AJ SNJ54AS1032AFK SNJ54AS1032AJ
Классификация производителя
- Semiconductors > Space & High Reliability > Logic Products > Gate Products
Варианты написания:
59628873001DA, 5962 8873001DA