Datasheet Texas Instruments LM2673SX-5.0/NOPB — Даташит
| Производитель | Texas Instruments |
| Серия | LM2673 |
| Модель | LM2673SX-5.0/NOPB |
Понижающий стабилизатор напряжения 3 А с регулируемым ограничением тока 7-DDPAK/TO-263 от -40 до 125
Datasheets
LM2673 SIMPLE SWITCHERВ® 3-A Step-Down Voltage Regulator With Adjustable Current Limit datasheet
PDF, 2.2 Мб, Версия: O, Файл опубликован: 30 июн 2016
Выписка из документа
Цены
 Купить LM2673SX-5.0/NOPB на РадиоЛоцман.Цены — от 115 до 1 299 ₽39 предложений от 17 поставщиков Интегральные микросхемы Силовые чипы — регуляторы напряжения — постоянного тока коммутирующие | |||
| LM2673SX-5.0/NOPB Texas Instruments | от 115 ₽ | ||
| LM2673SX-5.0/NOPB Texas Instruments | 167 ₽ | ||
| LM2673SX-5.0/NOPB Texas Instruments | 718 ₽ | ||
| LM2673SX-5.0/NOPB | по запросу | ||
Статус
| Статус продукта | В производстве (Рекомендуется для новых разработок) |
| Доступность образцов у производителя | Нет |
Корпус / Упаковка / Маркировка
| Pin | 7 | 7 |
| Package Type | KTW | KTW |
| Industry STD Term | TO-263 | TO-263 |
| JEDEC Code | R-PSFM-G | R-PSFM-G |
| Package QTY | 500 | 500 |
| Carrier | LARGE T&R | LARGE T&R |
| Маркировка | S-5.0 | LM2673 |
| Width (мм) | 8.89 | 8.89 |
| Length (мм) | 10.1 | 10.1 |
| Thickness (мм) | 4.44 | 4.44 |
| Pitch (мм) | 1.27 | 1.27 |
| Max Height (мм) | 4.65 | 4.65 |
| Mechanical Data | Скачать | Скачать |
Параметры
| Control Mode | Voltage Mode |
| Duty Cycle(Max) | 91 % |
| Iout(Max) | 3 A |
| Iq(Typ) | 4.2 мА |
| Рабочий диапазон температур | от -40 до 125 C |
| Package Group | DDPAK/TO-263 |
| Rating | Catalog |
| Regulated Outputs | 1 |
| Special Features | Enable |
| Switching Frequency(Max) | 260 kHz |
| Switching Frequency(Min) | 260 kHz |
| Тип | Converter |
| Vin(Max) | 40 В |
| Vin(Min) | 8 В |
| Vout(Max) | 37 В |
| Vout(Min) | 1.23 В |
Экологический статус
| RoHS | Совместим |
| Бессвинцовая технология (Pb Free) | Да |
Комплекты разработчика и оценочные наборы
- Evaluation Modules & Boards: LM2673-5.0EVAL
SIMPLE SWITCHERВ® 3A Step-Down Voltage Regulator with Adjustable Current Limit Evaluation Module
Статус продукта: В производстве (Рекомендуется для новых разработок)
Application Notes
- AN-643 EMI/RFI Board Design (Rev. B)PDF, 742 Кб, Версия: B, Файл опубликован: 3 май 2004
Application Note 643 EMI/RFI Board Design - AN-1187 Leadless Leadframe Package (LLP) (Rev. R)PDF, 21.3 Мб, Версия: R, Файл опубликован: 7 май 2013
This application report discusses the Leadless Leadframe Package (LLP). - Input and Output Capacitor SelectionPDF, 219 Кб, Файл опубликован: 19 сен 2005
- AN-1197 Selecting Inductors for Buck Converters (Rev. B)PDF, 558 Кб, Версия: B, Файл опубликован: 23 апр 2013
This application report provides design information to help select an off-the-shelf inductor for anycontinuous-mode buck converter application. - AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)PDF, 3.6 Мб, Версия: A, Файл опубликован: 23 апр 2013
This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor. - AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)PDF, 1.4 Мб, Версия: A, Файл опубликован: 23 апр 2013
This application note provides thermal power analysis techniques for analyzing the power IC. - AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)PDF, 2.7 Мб, Версия: A, Файл опубликован: 23 апр 2013
This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time. - Semiconductor and IC Package Thermal Metrics (Rev. C)PDF, 201 Кб, Версия: C, Файл опубликован: 19 апр 2016
- Low EMI Layout Made SIMPLE With LM43600/1/2/3 and LM46000/1/2 (Rev. A)PDF, 512 Кб, Версия: A, Файл опубликован: 12 сен 2014
Printed Circuit Board (PCB) layout for Switched Mode Power Supplies (SMPS) is critical to achieve proper converter operation good thermal performance and excellent radiated EMI performance. Optimized board layout for low radiated EMI is made very simple by the package and pin arrangement of the SIMPLE SWITCHER Synchronous Buck Converter family LM4360x and LM4600x - Simple Techniques Minimize Cross-Coupling in Distributed Power SystemsPDF, 335 Кб, Файл опубликован: 21 мар 2007
- AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)PDF, 82 Кб, Версия: C, Файл опубликован: 23 апр 2013
When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current - AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)PDF, 374 Кб, Версия: C, Файл опубликован: 23 апр 2013
This application report provides SIMPLE SWITCHER™ PCB layout guidelines. - AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)PDF, 2.5 Мб, Версия: C, Файл опубликован: 24 апр 2013
Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti - AN-1246 Stresses in Wide Input DC-DC Converters (Rev. C)PDF, 427 Кб, Версия: C, Файл опубликован: 23 апр 2013
This application note discusses stresses in wide input DC-DC converters. - AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)PDF, 9.2 Мб, Версия: B, Файл опубликован: 23 апр 2013
This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
Модельный ряд
Серия: LM2673 (26)
- LM2673S-12 LM2673S-12/NOPB LM2673S-3.3 LM2673S-3.3/NOPB LM2673S-5.0 LM2673S-5.0/NOPB LM2673S-ADJ LM2673S-ADJ/NOPB LM2673SD-12/NOPB LM2673SD-3.3/NOPB LM2673SD-5.0/NOPB LM2673SD-ADJ/NOPB LM2673SDX-3.3/NOPB LM2673SDX-5.0/NOPB LM2673SDX-ADJ/NOPB LM2673SX-12/NOPB LM2673SX-3.3/NOPB LM2673SX-5.0 LM2673SX-5.0/NOPB LM2673SX-ADJ LM2673SX-ADJ/NOPB LM2673T-12/NOPB LM2673T-3.3/NOPB LM2673T-5.0/NOPB LM2673T-ADJ LM2673T-ADJ/NOPB
Классификация производителя
- Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Down (Buck) > Buck Converter (Integrated Switch)
Варианты написания:
LM2673SX5.0/NOPB, LM2673SX 5.0/NOPB
