Data SheetADP2118ABSOLUTE MAXIMUM RATINGSTHERMAL RESISTANCETable 2. ParameterRating θJA is specified for the worst-case conditions, that is, a device VIN, PVIN −0.3 V to +6 V soldered in a circuit board for surface-mount packages. SW −0.3 V to +6 V Table 3. Thermal Resistance FB, SYNC/MODE, EN, TRK, FREQ, PGOOD −0.3 V to +6 V Package Type θ JAUnit PGND to GND −0.3 V to +0.3 V 16-Lead LFCSP 38.3 °C/W Operating Junction Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C Boundary Conditions Soldering Conditions JEDEC J-STD-020 θJA is measured using natural convection on a JEDEC 4-layer Stresses at or above those listed under Absolute Maximum board, and the exposed pad is soldered to the printed circuit Ratings may cause permanent damage to the product. This is a board with thermal vias. stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational ESD CAUTION section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. E | Page 5 of 24 Document Outline Features Applications General Description Revision History Specifications Absolute Maximum Ratings Thermal Resistance Boundary Conditions ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Functional Block Diagram Theory of Operation Control Scheme PWM Mode Operation PFM Mode Operation Slope Compensation Enable/Shutdown Integrated Soft Start Tracking Oscillator and Synchronization Current Limit and Short-Circuit Protection Overvoltage Protection (OVP) Undervoltage Lockout (UVLO) Thermal Shutdown Power Good Applications Information ADIsimPower™ Design Tool Output Voltage Selection Inductor Selection Output Capacitor Selection Input Capacitor Selection Voltage Tracking Typical Application Circuits Outline Dimensions Ordering Guide
