Корпус Intersil W3x5.15 — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
W3x5.15
15 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm pitch)
Rev 1, 6/14 X 1.51В±0.030 0.800 Y 0.400
E
15X 0.265В±0.035
2.15В±0.030 D
1.600 C
B (4X) 0.275 A 0.10 1 2 3 PIN 1
(A1 CORNER) 0.355 TOP VIEW BOTTOM VIEW Z
PACKAGE OUTLINE 0.05 Z SEATING PLANE
3 0.240
0.290
0.400
0.265В±0.035 15X
0.10 M Z X Y
0.05 M Z 0.200В±0.030
0.500В±0.050 RECOMMENDED LAND PATTERN SIDE VIEW NOTES:
1. Dimensions and tolerance per ASME Y 14.5M -1994.
2. Dimension is measured at the maximum bump diameter
parallel to primary datum Z .
3. Primary datum Z and seating plane are defined by the spherical
crowns of the bump. …