Корпус Intersil L32.5x6B — Даташит

Plastic Packages for Integrated Circuits
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP) L32.5x6B (One of 10 Packages in MDP0046)
32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220) A MILLIMETERS
D
N
(N-1)
(N-2) B 1
2
3 SYMBOL MIN NOMINAL MAX NOTES A 0.80 0.90 1.00 -A1 0.00 0.02 0.05 -D
PIN #1
I.D. MARK
E 5.00 BSC -D2 3.60 REF -E 6.00 BSC -E2 (N/2) 2X
0.075 C 2X
0.075 C b L 0.20 0.55 -0.22 0.24 -c 0.20 REF -e 0.50 BSC -N 32 REF 4 ND 7 REF 6 NE 9 REF 5
Rev 0 9/05 1. Dimensioning and tolerancing per ASME Y14.5M-1994. PIN #1 I.D. 2. Tiebar view shown is a non-functional feature. 3 3. Bottom-side pin #1 I.D. is a diepad chamfer as shown.
4. N is the total number of terminals on the device.
5. NE is the number of terminals on the “E” side of the package
(or Y-direction). (E2) 6. ND is the number of terminals on the “D” side of the package
(or X-direction). ND = (N/2)-NE. (N/2) NE 5 7. Inward end of terminal may be square or circular in shape with
radius (b/2) as shown. 7 (D2)
BOTTOM VIEW 0.10 C C (c) SEATING …